参数资料
| 型号： | XC2S100E-6FT256C |
| 厂商： | Xilinx Inc |
| 文件页数： | 36/108页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 1.8V 600 CLB'S 256-FBGA |
| 产品变化通告： | FPGA Family Discontinuation 18/Apr/2011 |
| 标准包装： | 90 |
| 系列： | Spartan®-IIE |
| LAB/CLB数： | 600 |
| 逻辑元件/单元数： | 2700 |
| RAM 位总计： | 40960 |
| 输入/输出数： | 182 |
| 门数： | 100000 |
| 电源电压： | 1.71 V ~ 1.89 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FTBGA |
| 其它名称： | 122-1208 |
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DS077-3 (v3.0) August 9, 2013
33
Product Specification
Spartan-IIE FPGA Family: DC and Switching Characteristics
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Power-On Requirements
Spartan-IIE FPGAs require that a minimum supply current
ICCPO be provided to the VCCINT lines for a successful
power-on. If more current is available, the FPGA can con-
sume more than ICCPO min., though this cannot adversely
affect reliability.
A maximum limit for ICCPO is not specified. Be careful when
using foldback/crowbar supplies and fuses. It is possible to
control the magnitude of ICCPO by limiting the supply current
available to the FPGA. A current limit below the trip level will
avoid inadvertently activating over-current protection cir-
cuits.
DC Input and Output Levels
Values for VIL and VIH are recommended input voltages.
Values for VOL and VOH are guaranteed output voltages
over the recommended operating conditions. Only selected
standards are tested. These are chosen to ensure that all
standards meet their specifications. The selected standards
are tested at minimum VCCO with the respective IOL and IOH
currents shown. Other standards are sample tested.
Symbol
Description
Min(1)
Typ
Max
Units
ICCPO
Total VCCINT supply current
required during power-on
Commercial
XC2S50E - XC2S300E
After PCN(2)
300
-
mA
Before
PCN(2)
500
-
mA
XC2S400E - XC2S600E
500
-
mA
Industrial
XC2S50E - XC2S300E
After PCN(2)
500
-
mA
Before
PCN(2)
2
-
A
XC2S400E - XC2S600E
700
-
mA
TCCPO
VCCINT(3,4) ramp time
After PCN(2)
500
-
μs
Before PCN(2)
2
-
50
ms
IHSPO
AC current per pin during power-on in
hot-swap applications when
VIN > VCCO + 0.4V; duration < 10ns
After PCN(2)
-
±60
-
μA
Notes:
1.
The ICCPO requirement applies for a brief time (commonly only a few milliseconds) when VCCINT ramps from 0 to 1.8V.
2.
Devices built after the Product Change Notice PCN 2002-05 (see
http://www.xilinx.com/support/documentation/customer_notices/pcn2002-05.pdf) have improved power-on requirements. Devices
after the PCN have a ‘T’ preceding the date code as referenced in the PCN. Note that the XC2S150E, XC2S400E, and XC2S600E
always have this mark. Devices before the PCN have an ‘S’ preceding the date code. Note that devices before the PCN are
measured with VCCINT and VCCO powering up simultaneously.
3.
The ramp time is measured from GND to 1.8V on a fully loaded board.
4.
VCCINT must not dip in the negative direction during power on.
5.
I/Os are not guaranteed to be disabled until VCCINT is applied.
6.
For more information on designing to meet the power-on specifications, refer to the application note XAPP450 "Power-On Current
Input/Output
Standard
VIL
VIH
VOL
VOH
IOL
IOH
V, Min
V, Max
V, Min
V, Max
V, Min
mA
LVTTL(1)
–0.5
0.8
2.0
3.6
0.4
2.4
24
–24
LVCMOS2
–0.5
0.7
1.7
2.7
0.4
1.9
12
–12
LVCMOS18
–0.5
35% VCCO
65% VCCO
1.95
0.4
VCCO – 0.4
8
–8
PCI, 3.3V
–0.5
30% VCCO
50% VCCO
VCCO + 0.5
10% VCCO
90% VCCO
Note (2)
GTL
–0.5
VREF – 0.05
VREF + 0.05
3.6
0.4
-
40
-
GTL+
–0.5
VREF – 0.1
VREF + 0.1
3.6
0.6
-
36
-
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相关代理商/技术参数 |
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|---|---|
| XC2S100E6FT256I | 制造商:Xilinx 功能描述: |
| XC2S100E-6FT256I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
| XC2S100E-6FTG256C | 功能描述:IC SPARTAN-IIE FPGA 100K 256FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S100E-6FTG256I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA |
| XC2S100E-6PQ208C | 功能描述:IC FPGA 1.8V 600 CLB'S 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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