参数资料
型号: XC2S100E-6FT256C
厂商: Xilinx Inc
文件页数: 4/108页
文件大小: 0K
描述: IC FPGA 1.8V 600 CLB'S 256-FBGA
产品变化通告: FPGA Family Discontinuation 18/Apr/2011
标准包装: 90
系列: Spartan®-IIE
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 182
门数: 100000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
其它名称: 122-1208
DS077-4 (v3.0) August 9, 2013
101
Product Specification
Spartan-IIE FPGA Family: Pinout Tables
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
I/O, L64N_YY
2
J25
All
-
I/O, L64N_YY
I/O (D2), L64P_YY
2
J24
All
-
I/O (D2), L64P_YY
I/O (D1)
2
J23
-
I/O (D1)
I/O, VREF Bank 2,
L63N_YY
2
J22
All
I/O, VREF Bank 2,
L63N_YY
I/O, VREF Bank 2,
L63N_YY
I/O, L63P_YY
2
J21
All
-
I/O, L63P_YY
I/O, L62N_YY
2
J20
All
-
I/O, L62N_YY
I/O, L62P_YY
2
J19
All
-
I/O, L62P_YY
I/O
2
H22
-
I/O
I/O, L61N
2
H26
XC2S600E
-
I/O
I/O, L61N_Y
I/O, L61P
2
H25
XC2S600E
-
I/O, VREF Bank 2,
L61P_Y
I/O, L60N
2
H21
XC2S400E
-
I/O, L60N_Y
I/O, L60N
I/O, L60P
2
H20
XC2S400E
-
I/O, L60P_Y
I/O, L60P
I/O
2
G26
-
I/O
I/O, L59N_YY
2
G25
All
-
I/O, L59N_YY
I/O, L59P_YY
2
G24
All
-
I/O, L59P_YY
I/O
2
G23
-
I/O
I/O, L58N_YY
2
G22
All
-
I/O, L58N_YY
I/O, VREF Bank 2,
L58P_YY
2
G21
All
I/O, VREF Bank 2,
L58P_YY
I/O, VREF Bank 2,
L58P_YY
I/O
2
G20
-
I/O
I/O, L57N_YY
2
F26
All
-
I/O, L57N_YY
I/O, L57P_YY
2
F25
All
-
I/O, L57P_YY
I/O, L56N
2
F24
XC2S600E
-
I/O, L56N
I/O, L56N_Y
I/O, L56P
2
F23
XC2S600E
-
I/O, L56P
I/O, L56P_Y
I/O
2
F22
-
I/O
I/O, L55N
2
E26
XC2S600E
-
I/O, L55N
I/O, L55N_Y
I/O, VREF Bank 2,
L55P
2
E25
XC2S600E
All
I/O, VREF Bank 2,
L55P
I/O, VREF Bank 2,
L55P_Y
I/O, L54N
2
E23
XC2S400E
-
I/O, L54N_Y
I/O, L54N
I/O, L54P
2
E22
XC2S400E
-
I/O, L54P_Y
I/O, L54P
I/O, L53N_YY
2
F21
All
-
I/O, L53N_YY
I/O, L53P_YY
2
E21
All
-
I/O, L53P_YY
I/O, L52N
2
D26
XC2S600E
-
I/O
I/O, L52N_Y
I/O, L52P
2
D25
XC2S600E
-
I/O, L52P_Y
FG676 Pinouts (XC2S400E, XC2S600E) (Continued)
Pad Name
Pin
LVDS Async.
Output Option
VREF
Option
Device-Specific Pinouts
Function
Bank
XC2S400E
XC2S600E
相关PDF资料
PDF描述
ABB91DHFT-S578 EDGECARD 182POS .050 SMD W/POSTS
24FC64FT-I/ST IC EEPROM 64KBIT 1MHZ 8TSSOP
24FC64FT-I/MS IC EEPROM 64KBIT 1MHZ 8MSOP
24LC64FT-E/OT IC SRL EEPROM 8KX8 2.5V SOT23-5
XC3S700A-4FT256I IC FPGA SPARTAN 3 256FTBGA
相关代理商/技术参数
参数描述
XC2S100E6FT256I 制造商:Xilinx 功能描述:
XC2S100E-6FT256I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA
XC2S100E-6FTG256C 功能描述:IC SPARTAN-IIE FPGA 100K 256FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S100E-6FTG256I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA
XC2S100E-6PQ208C 功能描述:IC FPGA 1.8V 600 CLB'S 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)