参数资料
型号: XC2S150-5FG256C
厂商: Xilinx Inc
文件页数: 17/99页
文件大小: 0K
描述: IC FPGA 2.5V 864 CLB'S 256-FBGA
标准包装: 90
系列: Spartan®-II
LAB/CLB数: 864
逻辑元件/单元数: 3888
RAM 位总计: 49152
输入/输出数: 176
门数: 150000
电源电压: 2.375 V ~ 2.625 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 256-BGA
供应商设备封装: 256-FBGA(17x17)
其它名称: 122-1230
XC2S150-5FG256C-ND
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
24
R
Multiple Spartan-II FPGAs can be configured using the
Slave Parallel mode, and be made to start-up
simultaneously. To configure multiple devices in this way,
wire the individual CCLK, Data, WRITE, and BUSY pins of
all the devices in parallel. The individual devices are loaded
separately by asserting the CS pin of each device in turn
and writing the appropriate data. Sync-to-DONE start-up
timing is used to ensure that the start-up sequence does not
begin until all the FPGAs have been loaded. See "Start-up,"
Write
When using the Slave Parallel Mode, write operations send
packets of byte-wide configuration data into the FPGA.
Figure 19, page 25 shows a flowchart of the write sequence
used to load data into the Spartan-II FPGA. This is an
expansion of the "Load Configuration Data Frames" block in
Figure 11, page 18. The timing for write operations is shown
For the present example, the user holds WRITE and CS
Low throughout the sequence of write operations. Note that
when CS is asserted on successive CCLKs, WRITE must
remain either asserted or de-asserted. Otherwise an abort
will be initiated, as in the next section.
1.
Drive data onto D0-D7. Note that to avoid contention,
the data source should not be enabled while CS is Low
and WRITE is High. Similarly, while WRITE is High, no
more than one device’s CS should be asserted.
2.
On the rising edge of CCLK: If BUSY is Low, the data is
accepted on this clock. If BUSY is High (from a previous
write), the data is not accepted. Acceptance will instead
occur on the first clock after BUSY goes Low, and the
data must be held until this happens.
3.
Repeat steps 1 and 2 until all the data has been sent.
4.
De-assert CS and WRITE.
Figure 18: Slave Parallel Configuration Circuit Diagram
M1 M2
M0
D0:D7
CCLK
WRITE
BUSY
CS
PROGRAM
DONEINIT
CCLK
DATA[7:0]
WRITE
BUSY
CS(0)
330
Ω
Spartan-II
FPGA
DONE
INIT
PROGRAM
M1 M2
M0
D0:D7
CCLK
WRITE
BUSY
CS
PROGRAM
DONEINIT
CS(1)
Spartan-II
FPGA
DS001_18_060608
GND
相关PDF资料
PDF描述
ABB92DHRT-S329 CARD EXTEND PCI 184POS .050 3.3V
XA3S500E-4CPG132I IC FPGA SPARTAN-3E 500K 132CSBGA
XC6SLX16-3FTG256C IC FPGA SPARTAN 6 14K 256FTGBGA
XC6SLX16-3CSG225C IC FPGA SPARTAN 6 14K 225CSGBGA
AMC31DRYN-S13 CONN EDGECARD 62POS .100 EXTEND
相关代理商/技术参数
参数描述
XC2S150-5FG256C-ES 制造商:Xilinx 功能描述: 制造商:Xilinx 功能描述:Field-Programmable Gate Array, 3888 Cell, 256 Pin, Plastic, BGA
XC2S150-5FG256I 功能描述:IC FPGA 2.5V I-TEMP 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S150-5FG456C 功能描述:IC FPGA 2.5V 864 CLB'S 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S150-5FG456I 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S150-5FGG256C 功能描述:IC SPARTAN-II FPGA 150K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)