参数资料
| 型号： | XC2S150-5FG256C |
| 厂商： | Xilinx Inc |
| 文件页数： | 47/99页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2.5V 864 CLB'S 256-FBGA |
| 标准包装： | 90 |
| 系列： | Spartan®-II |
| LAB/CLB数： | 864 |
| 逻辑元件/单元数： | 3888 |
| RAM 位总计： | 49152 |
| 输入/输出数： | 176 |
| 门数： | 150000 |
| 电源电压： | 2.375 V ~ 2.625 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 256-BGA |
| 供应商设备封装： | 256-FBGA（17x17） |
| 其它名称： | 122-1230 XC2S150-5FG256C-ND |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页当前第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页
DS001-3 (v2.8) June 13, 2008
Module 3 of 4
Product Specification
51
2000-2008 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
Definition of Terms
In this document, some specifications may be designated as Advance or Preliminary. These terms are defined as follows:
Advance: Initial estimates based on simulation and/or extrapolation from other speed grades, devices, or families. Values
are subject to change. Use as estimates, not for production.
Preliminary: Based on preliminary characterization. Further changes are not expected.
Unmarked: Specifications not identified as either Advance or Preliminary are to be considered Final.
Except for pin-to-pin input and output parameters, the AC parameter delay specifications included in this document are
derived from measuring internal test patterns. All limits are representative of worst-case supply voltage and junction
temperature conditions. Typical numbers are based on measurements taken at a nominal VCCINT level of 2.5V and a junction
temperature of 25°C. The parameters included are common to popular designs and typical applications. All specifications
are subject to change without notice.
DC Specifications
Absolute Maximum Ratings(1)
68
Spartan-II FPGA Family:
DC and Switching Characteristics
DS001-3 (v2.8) June 13, 2008
Product Specification
R
Symbol
Description
Min
Max
Units
VCCINT
Supply voltage relative to GND(2)
–0.5
3.0
V
VCCO
Supply voltage relative to GND(2)
–0.5
4.0
V
VREF
Input reference voltage
–0.5
3.6
V
VIN
Input voltage relative to GND(3)
5V tolerant I/O(4)
–0.5
5.5
V
No 5V tolerance(5)
–0.5
VCCO +0.5
V
VTS
Voltage applied to 3-state output
5V tolerant I/O (4)
–0.5
5.5
V
No 5V tolerance(5)
–0.5
VCCO +0.5
V
TSTG
Storage temperature (ambient)
–65
+150
°C
TJ
Junction temperature
-
+125
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
Power supplies may turn on in any order.
3.
VIN should not exceed VCCO by more than 3.6V over extended periods of time (e.g., longer than a day).
4.
Spartan-II device I/Os are 5V Tolerant whenever the LVTTL, LVCMOS2, or PCI33_5 signal standard has been selected. With 5V
Tolerant I/Os selected, the Maximum DC overshoot must be limited to either +5.5V or 10 mA, and undershoot must be limited to
either –0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot
to –2.0V or overshoot to +7.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
5.
Without 5V Tolerant I/Os selected, the Maximum DC overshoot must be limited to either VCCO + 0.5V or 10 mA, and undershoot must
be limited to –0.5V or 10 mA, whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may
undershoot to –2.0V or overshoot to VCCO + 2.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no
greater than 100 mA.
6.
相关PDF资料 |
PDF描述 |
|---|---|
| ABB92DHRT-S329 | CARD EXTEND PCI 184POS .050 3.3V |
| XA3S500E-4CPG132I | IC FPGA SPARTAN-3E 500K 132CSBGA |
| XC6SLX16-3FTG256C | IC FPGA SPARTAN 6 14K 256FTGBGA |
| XC6SLX16-3CSG225C | IC FPGA SPARTAN 6 14K 225CSGBGA |
| AMC31DRYN-S13 | CONN EDGECARD 62POS .100 EXTEND |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC2S150-5FG256C-ES | 制造商:Xilinx 功能描述: 制造商:Xilinx 功能描述:Field-Programmable Gate Array, 3888 Cell, 256 Pin, Plastic, BGA |
| XC2S150-5FG256I | 功能描述:IC FPGA 2.5V I-TEMP 256-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S150-5FG456C | 功能描述:IC FPGA 2.5V 864 CLB'S 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S150-5FG456I | 功能描述:IC FPGA 2.5V I-TEMP 456-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC2S150-5FGG256C | 功能描述:IC SPARTAN-II FPGA 150K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-II 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
发布紧急采购，3分钟左右您将得到回复。