参数资料
| 型号： | XC3S1200E-5FTG256C |
| 厂商： | Xilinx Inc |
| 文件页数： | 101/227页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN3E 1200K 256FTBGA |
| 标准包装： | 90 |
| 系列： | Spartan®-3E |
| LAB/CLB数： | 2168 |
| 逻辑元件/单元数： | 19512 |
| RAM 位总计： | 516096 |
| 输入/输出数： | 190 |
| 门数： | 1200000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FTBGA |
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Spartan-3E FPGA Family: Functional Description
DS312 (v4.1) July 19, 2013
Product Specification
19
IOBs Organized into Banks
The Spartan-3E architecture organizes IOBs into four I/O
banks as shown in Figure 13. Each bank maintains
separate VCCO and VREF supplies. The separate supplies
allow each bank to independently set VCCO. Similarly, the
When working with Spartan-3E devices, most of the
differential I/O standards are compatible and can be
combined within any given bank. Each bank can support
any two of the following differential standards: LVDS_25
outputs, MINI_LVDS_25 outputs, and RSDS_25 outputs. As
an example, LVDS_25 outputs, RSDS_25 outputs, and any
other differential inputs while using on-chip differential
termination are a valid combination. A combination not
allowed is a single bank with LVDS_25 outputs, RSDS_25
outputs, and MINI_LVDS_25 outputs.
I/O Banking Rules
When assigning I/Os to banks, these VCCO rules must be
followed:
1.
All VCCO pins on the FPGA must be connected even if a
bank is unused.
2.
All VCCO lines associated within a bank must be set to
the same voltage level.
3.
The VCCO levels used by all standards assigned to the
I/Os of any given bank must agree. The Xilinx
development software checks for this. Table 6 and
Table 7 describe how different standards use the VCCO
supply.
4.
If a bank does not have any VCCO requirements,
connect VCCO to an available voltage, such as 2.5V or
3.3V. Some configuration modes might place additional
information.
If any of the standards assigned to the Inputs of the bank
use VREF, then the following additional rules must be
observed:
1.
All VREF pins must be connected within a bank.
2.
All VREF lines associated with the bank must be set to
the same voltage level.
3.
The VREF levels used by all standards assigned to the
Inputs of the bank must agree. The Xilinx development
software checks for this. Table 6 describes how different
standards use the VREF supply.
If VREF is not required to bias the input switching thresholds,
all associated VREF pins within the bank can be used as
user I/Os or input pins.
Package Footprint Compatibility
Sometimes, applications outgrow the logic capacity of a
specific Spartan-3E FPGA. Fortunately, the Spartan-3E
family is designed so that multiple part types are available in
pin-compatible package footprints, as described in
Module 4, Pinout Descriptions. In some cases, there are
subtle differences between devices available in the same
footprint. These differences are outlined for each package,
such as pins that are unconnected on one device but
connected on another in the same package or pins that are
dedicated inputs on one package but full I/O on another.
When designing the printed circuit board (PCB), plan for
potential future upgrades and package migration.
The Spartan-3E family is not pin-compatible with any
previous Xilinx FPGA family.
Dedicated Inputs
Dedicated Inputs are IOBs used only as inputs. Pin names
designate a Dedicated Input if the name starts with IP, for
example, IP or IP_Lxxx_x. Dedicated inputs retain the full
functionality of the IOB for input functions with a single
exception for differential inputs (IP_Lxxx_x). For the
differential Dedicated Inputs, the on-chip differential
termination is not available. To replace the on-chip
differential termination, choose a differential pair that
supports outputs (IO_Lxxx_x) or use an external 100
Ω
termination resistor on the board.
ESD Protection
Clamp diodes protect all device pads against damage from
Electro-Static Discharge (ESD) as well as excessive voltage
transients. Each I/O has two clamp diodes: one diode
extends P-to-N from the pad to VCCO and a second diode
extends N-to-P from the pad to GND. During operation,
these diodes are normally biased in the off state. These
clamp diodes are always connected to the pad, regardless
of the signal standard selected. The presence of diodes
limits the ability of Spartan-3E I/Os to tolerate high signal
Module 3, DC and Switching Characteristics specifies the
voltage range that I/Os can tolerate.
X-Ref Target - Figure 13
Figure 13: Spartan-3E I/O Banks (top view)
DS312-2_26_021205
Bank 0
Bank 2
Bank
3
Bank
1
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相关代理商/技术参数 |
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| XC3S1200E-5FTG256I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-3E FPGA Family |
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| XC3S1200E-5PQG208I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-3E FPGA Family |
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