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参数资料
型号： XC3S200A-4VQ100I
厂商： Xilinx Inc
文件页数： 78/132页
文件大小： 0K
描述： IC FPGA SPARTAN 3 100VQFP
标准包装： 90
系列： Spartan®-3A
LAB/CLB数： 448
逻辑元件/单元数： 4032
RAM 位总计： 294912
输入/输出数： 68
门数： 200000
电源电压： 1.14 V ~ 1.26 V
安装类型： 表面贴装
工作温度： -40°C ~ 100°C
封装/外壳： 100-TQFP
供应商设备封装： 100-VQFP（14x14）
Introduction and Ordering Information
DS529-1 (v2.0) August 19, 2010
www.xilinx.com
5
Configuration
Spartan-3A FPGAs are programmed by loading
configuration data into robust, reprogrammable, static
CMOS configuration latches (CCLs) that collectively control
all functional elements and routing resources. The FPGA’s
configuration data is stored externally in a PROM or some
other non-volatile medium, either on or off the board. After
applying power, the configuration data is written to the
FPGA using any of seven different modes:
Master Serial from a Xilinx Platform Flash PROM
Serial Peripheral Interface (SPI) from an
industry-standard SPI serial Flash
Byte Peripheral Interface (BPI) Up from an
industry-standard x8 or x8/x16 parallel NOR Flash
Slave Serial, typically downloaded from a processor
Slave Parallel, typically downloaded from a processor
Boundary Scan (JTAG), typically downloaded from a
processor or system tester
Furthermore, Spartan-3A FPGAs support MultiBoot
configuration, allowing two or more FPGA configuration
bitstreams to be stored in a single SPI serial Flash or a BPI
parallel NOR Flash. The FPGA application controls which
configuration to load next and when to load it.
Additionally, each Spartan-3A FPGA contains a unique,
factory-programmed Device DNA identifier useful for
tracking purposes, anti-cloning designs, or IP protection.
I/O Capabilities
The Spartan-3A FPGA SelectIO interface supports many
popular single-ended and differential standards. Table 2
shows the number of user I/Os as well as the number of
differential I/O pairs available for each device/package
combination. Some of the user I/Os are unidirectional
input-only pins as indicated in Table 2.
Spartan-3A FPGAs support the following single-ended
standards:
3.3V low-voltage TTL (LVTTL)
Low-voltage CMOS (LVCMOS) at 3.3V, 2.5V, 1.8V,
1.5V, or 1.2V
3.3V PCI at 33 MHz or 66 MHz
HSTL I, II, and III at 1.5V and 1.8V, commonly used in
memory applications
SSTL I and II at 1.8V, 2.5V, and 3.3V, commonly used
for memory applications
Spartan-3A FPGAs support the following differential
standards:
LVDS, mini-LVDS, RSDS, and PPDS I/O at 2.5V or
3.3V
Bus LVDS I/O at 2.5V
TMDS I/O at 3.3V
Differential HSTL and SSTL I/O
LVPECL inputs at 2.5V or 3.3V
Table 2: Available User I/Os and Differential (Diff) I/O Pairs
Package
VQ100
VQG100
TQ144
TQG144
FT256
FTG256
FG320
FGG320
FG400
FGG400
FG484
FGG484
FG676
FGG676
Body Size
(mm)
14 x 14(2)
20 x 20(2)
17 x 17
19 x 19
21 x 21
23 x 23
27 x 27
Device
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
User
Diff
XC3S50A
68
(13)
60
(24)
108
(7)
50
(24)
144
(32)
64
(32)
-
XC3S200A
68
(13)
60
(24)
-
195
(35)
90
(50)
248
(56)
112
(64)
-
XC3S400A
-
195
(35)
90
(50)
251
(59)
112
(64)
311
(63)
142
(78)
-
XC3S700A
-
161
(13)
74
(36)
-
311
(63)
142
(78)
372
(84)
165
(93)
-
XC3S1400A
-
161
(13)
74
(36)
-
375
(87)
165
(93)
502
(94)
227
(131)
Notes:
1.
The number shown in bold indicates the maximum number of I/O and input-only pins. The number shown in (italics) indicates the number
of input-only pins. The differential (Diff) input-only pin count includes both differential pairs on input-only pins and differential pairs on I/O pins
within I/O banks that are restricted to differential inputs.
2.
The footprints for the VQ/TQ packages are larger than the package body. See the Package Drawings for details.
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相关代理商/技术参数
参数描述
XC3S200A-4VQG100C 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S200A-4VQG100I 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28）
XC3S200A-5FG320C 功能描述:IC SPARTAN-3A FPGA 200K 320FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S200A-5FGG320C 功能描述:IC SPARTAN-3A FPGA 200K 320-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XC3S200A-5FT256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
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