参数资料
型号: XC3S200A-4VQ100I
厂商: Xilinx Inc
文件页数: 89/132页
文件大小: 0K
描述: IC FPGA SPARTAN 3 100VQFP
标准包装: 90
系列: Spartan®-3A
LAB/CLB数: 448
逻辑元件/单元数: 4032
RAM 位总计: 294912
输入/输出数: 68
门数: 200000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 100-TQFP
供应商设备封装: 100-VQFP(14x14)
Introduction and Ordering Information
6
DS529-1 (v2.0) August 19, 2010
Production Status
Table 3 indicates the production status of each Spartan-3A
FPGA by temperature range and speed grade. The table
also lists the earliest speed file version required for creating
a production configuration bitstream. Later versions are also
supported.
Package Marking
Figure 2 provides a top marking example for Spartan-3A
FPGAs in the quad-flat packages. Figure 3 shows the top
marking for Spartan-3A FPGAs in BGA packages. The
markings for the BGA packages are nearly identical to those
for the quad-flat packages, except that the marking is
rotated with respect to the ball A1 indicator.
The “5C” and “4I” Speed Grade/Temperature Range part
combinations may be dual marked as “5C/4I”. Devices with
a single mark are only guaranteed for the marked speed
grade and temperature range.
Table 3: Spartan-3A FPGA Production Status (Production Speed File)
Temperature Range
Commercial (C)
Industrial
Speed Grade
Standard (–4)
High-Performance (–5)
Standard (–4)
Pa
rt
N
u
m
b
e
r
XC3S50A
Production
(v1.35)
Production
(v1.35)
Production
(v1.35)
XC3S200A
Production
(v1.35)
Production
(v1.35)
Production
(v1.35)
XC3S400A
Production
(v1.36)
Production
(v1.36)
Production
(v1.36)
XC3S700A
Production
(v1.34)
Production
(v1.35)
Production
(v1.34)
XC3S1400A
Production
(v1.34)
Production
(v1.35)
Production
(v1.34)
Figure 2: Spartan-3A QFP Package Marking Example
Figure 3: Spartan-3A BGA Package Marking Example
Date Code
Mask Revision Code
Process Technology
XC3S50A
TM
TQ144AGQ0625
D1234567A
4C
SPARTAN
Device Type
Package
Speed Grade
Temperature Range
Fabrication Code
Pin P1
R
DS529-1_03_080406
Lot Code
Date Code
XC3S50A
TM
4C
SPARTAN
Device Type
BGA Ball A1
Package
Speed Grade
Temperature Range
R
DS529-1_02_021206
FT256 AGQ0625
D1234567A
Mask Revision Code
Process Code
Fabrication Code
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参数描述
XC3S200A-4VQG100C 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S200A-4VQG100I 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP(28x28)
XC3S200A-5FG320C 功能描述:IC SPARTAN-3A FPGA 200K 320FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S200A-5FGG320C 功能描述:IC SPARTAN-3A FPGA 200K 320-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC3S200A-5FT256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)