参数资料
型号: XC3S250E-5PQG208C
厂商: Xilinx Inc
文件页数: 35/227页
文件大小: 0K
描述: IC FPGA SPARTAN-3E 250K 208-PQFP
标准包装: 24
系列: Spartan®-3E
LAB/CLB数: 612
逻辑元件/单元数: 5508
RAM 位总计: 221184
输入/输出数: 158
门数: 250000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页当前第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页第133页第134页第135页第136页第137页第138页第139页第140页第141页第142页第143页第144页第145页第146页第147页第148页第149页第150页第151页第152页第153页第154页第155页第156页第157页第158页第159页第160页第161页第162页第163页第164页第165页第166页第167页第168页第169页第170页第171页第172页第173页第174页第175页第176页第177页第178页第179页第180页第181页第182页第183页第184页第185页第186页第187页第188页第189页第190页第191页第192页第193页第194页第195页第196页第197页第198页第199页第200页第201页第202页第203页第204页第205页第206页第207页第208页第209页第210页第211页第212页第213页第214页第215页第216页第217页第218页第219页第220页第221页第222页第223页第224页第225页第226页第227页
Spartan-3E FPGA Family: Functional Description
DS312 (v4.1) July 19, 2013
Product Specification
13
Storage Element Functions
There are three pairs of storage elements in each IOB, one
pair for each of the three paths. It is possible to configure
each of these storage elements as an edge-triggered
D-type flip-flop (FD) or a level-sensitive latch (LD).
The storage-element pair on either the Output path or the
Three-State path can be used together with a special
multiplexer to produce Double-Data-Rate (DDR)
transmission. This is accomplished by taking data
synchronized to the clock signal’s rising edge and
converting it to bits synchronized on both the rising and the
falling edge. The combination of two registers and a
multiplexer is referred to as a Double-Data-Rate D-type
flip-flop (ODDR2).
Table 4 describes the signal paths associated with the
storage element.
As shown in Figure 5, the upper registers in both the output
and three-state paths share a common clock. The OTCLK1
clock signal drives the CK clock inputs of the upper registers
on the output and three-state paths. Similarly, OTCLK2
drives the CK inputs for the lower registers on the output
and three-state paths. The upper and lower registers on the
input path have independent clock lines: ICLK1 and ICLK2.
The OCE enable line controls the CE inputs of the upper
and lower registers on the output path. Similarly, TCE
controls the CE inputs for the register pair on the three-state
path and ICE does the same for the register pair on the
input path.
The Set/Reset (SR) line entering the IOB controls all six
registers, as is the Reverse (REV) line.
In addition to the signal polarity controls described in IOB
Overview, each storage element additionally supports the
controls described in Table 5.
Table 4: Storage Element Signal Description
Storage
Element
Signal
Description
Function
D
Data input
Data at this input is stored on the active edge of CK and enabled by CE. For latch operation when
the input is enabled, data passes directly to the output Q.
Q
Data output
The data on this output reflects the state of the storage element. For operation as a latch in
transparent mode, Q mirrors the data at D.
CK
Clock input
Data is loaded into the storage element on this input’s active edge with CE asserted.
CE
Clock Enable input
When asserted, this input enables CK. If not connected, CE defaults to the asserted state.
SR
Set/Reset input
This input forces the storage element into the state specified by the SRHIGH/SRLOW attributes.
The SYNC/ASYNC attribute setting determines if the SR input is synchronized to the clock or not.
If both SR and REV are active at the same time, the storage element gets a value of 0.
REV
Reverse input
This input is used together with SR. It forces the storage element into the state opposite from what
SR does. The SYNC/ASYNC attribute setting determines whether the REV input is synchronized
to the clock or not. If both SR and REV are active at the same time, the storage element gets a
value of 0.
Table 5: Storage Element Options
Option Switch
Function
Specificity
FF/Latch
Chooses between an edge-triggered flip-flop or a
level-sensitive latch
Independent for each storage element
SYNC/ASYNC
Determines whether the SR set/reset control is
synchronous or asynchronous
Independent for each storage element
SRHIGH/SRLOW
Determines whether SR acts as a Set, which forces
the storage element to a logic 1 (SRHIGH) or a
Reset, which forces a logic 0 (SRLOW)
Independent for each storage element, except when using
ODDR2. In the latter case, the selection for the upper
element will apply to both elements.
INIT1/INIT0
When Global Set/Reset (GSR) is asserted or after
configuration this option specifies the initial state of
the storage element, either set (INIT1) or reset
(INIT0). By default, choosing SRLOW also selects
INIT0; choosing SRHIGH also selects INIT1.
Independent for each storage element, except when using
ODDR2, which uses two IOBs. In the ODDR2 case,
selecting INIT0 for one IOBs applies to both elements
within the IOB, although INIT1 could be selected for the
elements in the other IOB.
相关PDF资料
PDF描述
XC3S400AN-4FTG256I IC FPGA SPARTAN-3AN 256FTBGA
XC3S500E-4VQG100C IC FPGA SPARTAN-3E 500K 100-VQFP
GEC50DTEH CONN EDGECARD 100POS .100 EYELET
24FC64T-I/SM IC EEPROM 64KBIT 1MHZ 8SOIC
25LC010AT-E/OT IC EEPROM 1KBIT 10MHZ SOT23-6
相关代理商/技术参数
参数描述
XC3S250E-5PQG208I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-3E FPGA Family
XC3S250E-5TQ144C 制造商:Xilinx 功能描述:FPGA SPARTAN-3E 250K GATES 5508 CELLS 657MHZ COMM 90NM 1.2V - Trays
XC3S250E-5TQ144I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-3E FPGA Family
XC3S250E5TQG144C 制造商:XILINX 功能描述:New
XC3S250E-5TQG144C 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)