参数资料
型号: ZXMN3B01FTA
厂商: Diodes Inc
文件页数: 2/7页
文件大小: 0K
描述: MOSFET N-CHAN 30V 2A SOT23-3
其它图纸: SOT-23
SOT-23 Top
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 1.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 150 毫欧 @ 1.7A,4.5V
Id 时的 Vgs(th)(最大): 700mV @ 250µA
闸电荷(Qg) @ Vgs: 2.93nC @ 4.5V
输入电容 (Ciss) @ Vds: 258pF @ 15V
功率 - 最大: 625mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3
包装: 标准包装
产品目录页面: 1472 (CN2011-ZH PDF)
其它名称: ZXMN3B01FDKR
ZXMN3B01F
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ V GS =4.5V; T A =25°C (b)
@ V GS =4.5V; T A =70°C (b)
@ V GS =4.5V; T A =25°C (a)
SYMBOL
V DSS
V GS
I D
LIMIT
30
12
2.0
1.6
1.7
UNIT
V
V
A
A
A
Pulsed Drain Current
(c)
I DM
9.4
A
Continuous Source Current (Body Diode) (b)
Pulsed Source Current (Body Diode) (c)
Power Dissipation at T A =25°C (a)
Linear Derating Factor
I S
I SM
P D
1.3
9.4
625
5
A
A
mW
mW/°C
Power Dissipation at T A =25°C
Linear Derating Factor
(b)
P D
806
6.4
mW
mW/°C
Operating and Storage Temperature Range
T j , T stg
-55 to +150
°C
THERMAL RESISTANCE
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient
(a)
R JA
200
°C/W
Junction to Ambient (b)
R JA
155
°C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t
5 sec.
(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300 s - pulse width limited by maximum junction temperature.
ISSUE 1 - DECEMBER 2005
SEMICONDUCTORS
2
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