参数资料
型号: ZXMP10A17E6TA
厂商: Diodes Inc
文件页数: 2/7页
文件大小: 0K
描述: MOSFET P-CH TRENCH -100V SOT23-6
其它图纸: SOT-23-6 Pin Out
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 100V
电流 - 连续漏极(Id) @ 25° C: 1.3A
开态Rds(最大)@ Id, Vgs @ 25° C: 350 毫欧 @ 1.4A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 6.1nC @ 5V
输入电容 (Ciss) @ Vds: 424pF @ 50V
功率 - 最大: 1.1W
安装类型: 表面贴装
封装/外壳: SOT-23-6
供应商设备封装: SOT-23-6
包装: 标准包装
产品目录页面: 1474 (CN2011-ZH PDF)
其它名称: ZXMP10A17E6DKR
ZXMP10A17E6
Maximum Ratings (@T A = +25°C, unless otherwise specified.)
Drain-Source Voltage
Gate-Source Voltage
Characteristic
(Note 6)
Symbol
V DSS
V GS
Value
-100
± 20
-1.6
Unit
V
V
Continuous Drain Current
V GS = 10V
T A = +70°C (Note 6)
I D
-1.3
A
(Note 5)
-1.3
Pulsed Drain Current
V GS = 10V
(Note 7)
I DM
-7.7
A
Continuous Source Current (Body diode)
Pulsed Source Current (Body diode)
(Note 6)
(Note 7)
I S
I SM
-2.1
-7.7
A
A
Thermal Characteristics (@T A = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power dissipation
Linear derating factor
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
(Note 5)
(Note 6)
(Note 5)
(Note 6)
P D
R θ JA
T J , T STG
1.1
8.8
1.7
13.7
113
73
-55 to +150
W
mW/ ° C
° C/W
° C
Electrical Characteristics (@T A = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV DSS
I DSS
I GSS
-100
?
?
?
?
?
?
-0.5
± 100
V
μA
nA
I D = -250μA, V GS = 0V
V DS = -100V, V GS = 0V
V GS = ± 20V, V DS = 0V
ON CHARACTERISTICS
Gate Threshold Voltage
Static Drain-Source On-Resistance (Note 8)
Forward Transconductance (Notes 8 & 9)
Diode Forward Voltage (Note 8)
Reverse recovery time (Note 9)
Reverse recovery charge (Note 9)
V GS(th)
R DS(ON)
g fs
V SD
t rr
Q rr
-2
?
?
?
?
?
?
2.8
-0.85
33
48
-4
0.35
0.45
?
-0.95
?
?
V
?
S
V
ns
nC
I D = -250μA, V DS = V GS
V GS = -10V, I D = -1.4A
V GS = -6V, I D = -1.2A
V DS = -15V, I D = -1.4A
I S = -1.7A, V GS = 0V
I S = -1.5A, di/dt = 100A/μs
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge (Note 10)
Total Gate Charge (Note 10)
C iss
C oss
C rss
Q g
Q g
?
?
?
?
?
424
36.6
29.8
7.1
10.7
?
?
?
?
?
pF
pF
pF
nC
nC
V DS = -50V, V GS = 0V
F = 1MHz
V GS = -6V
V DS = -50V
Gate-Source Charge (Note 10)
Gate-Drain Charge (Note 10)
Turn-On Delay Time (Note 10)
Q gs
Q gd
t D(on)
?
?
?
1.7
3.8
3
?
?
?
nC
nC
ns
V GS = -10V
I D = -1.4A
Turn-On Rise Time (Note 10)
Turn-Off Delay Time (Note 10)
Turn-Off Fall Time (Note 10)
t r
t D(off)
t f
?
?
?
3.5
13.4
7.2
?
?
?
ns
ns
ns
V DD = -50V, V GS = -10V
I D = -1A, R G ? 6 ?
Notes:
5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is measured
when operating in a steady-state condition.
6. Same as note (5), except the device is measured at t ≤ 5 sec.
7. Same as note (5), except the device is pulsed with D = 0.05 and pulse width 10μs. The pulse current is limited by the maximum junction temperature.
8. Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%.
9. For design aid only, not subject to production testing.
10. Switching characteristics are independent of operating junction temperatures.
ZXMP10A17E6
Document Number DS32027 Rev. 6 - 2
2 of 7
www.diodes.com
January 2014
? Diodes Incorporated
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