参数资料
型号: ZXMP6A13FTA
厂商: Diodes Inc
文件页数: 2/8页
文件大小: 0K
描述: MOSFET P-CH 60V 900MA SOT23-3
其它图纸: SOT-23
SOT-23 Top
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 900mA
开态Rds(最大)@ Id, Vgs @ 25° C: 400 毫欧 @ 900mA,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 5.9nC @ 10V
输入电容 (Ciss) @ Vds: 219pF @ 30V
功率 - 最大: 625mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: SOT-23-3
包装: 标准包装
产品目录页面: 1474 (CN2011-ZH PDF)
其它名称: ZXMP6A13FDKR
A Product Line of
Diodes Incorporated
ZXMP6A13F
Maximum Ratings (@T A = +25°C, unless otherwise specified.)
Drain-Source Voltage
Gate-Source Voltage
Characteristic
(Note 7)
Symbol
V DSS
V GS
Value
-60
±20
-1.1
Units
V
V
Continuous Drain Current
V GS = 10V
T A = 70°C
(Note 7)
I D
-0.8
A
(Note 6)
-0.9
Pulsed Drain Current (Note 8)
Continuous Source Current (Body Diode) (Note 7)
Pulsed Source Current (Body Diode) (Note 8)
I DM
I S
I SM
-4.0
-1.2
-4.0
A
A
A
Thermal Characteristics (@T A = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation (Note 6)
Linear Derating Factor
Power Dissipation (Note 7)
Linear Derating Factor
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Leads (Note 9)
Operating and Storage Temperature Range
Symbol
P D
P D
R θ JA
R θ JA
R θ JL
T J, T STG
Value
625
5
806
6.5
200
155
194
-55 to +150
Unit
mW
mW/°C
mW
mW/°C
°C/W
°C/W
°C/W
°C
Notes:
6. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
7. For a device surface mounted on FR4 PCB measured at t ≤ 5 secs.
8. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05 pulse width = 10 μ s - pulse current limited by maximum junction temperature.
9. Thermal resistance from junction to solder-point (at the end of the collector lead).
ZXMP6A13F
Document Number DS32014 Rev. 6 - 2
2 of 8
www.diodes.com
September 2012
? Diodes Incorporated
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