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参数资料
| 型号： | 72225LB25TFG |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | FIFO |
| 英文描述： | 1K X 18 OTHER FIFO, 15 ns, PQFP64 |
| 封装： | GREEN, PLASTIC, STQFP-64 |
| 文件页数： | 7/16页 |
| 文件大小： | 178K |
| 代理商： | 72225LB25TFG |
15
IDT72205LB/72215LB/72225LB/72235LB/72245LB CMOS SyncFIFOTM
256 x 18, 512 x 18, 1,024 x 18, 2,048 x 18 and 4,096 x 18
COMMERCIALANDINDUSTRIAL
TEMPERATURERANGES
OCTOBER 22, 2008
Figure 21. Block Diagram of 768 x 18, 1,536 x 18, 3,072 x 18, 6,144 x 18, 12,288 x 18 Synchronous
FIFO Memory With Programmable Flags used in Depth Expansion Configuration
LOAD
WRITE CLOCK
WRITE ENABLE
READ CLOCK
READ ENABLE
OUTPUT ENABLE
DATA IN
DATA OUT
RESET
IDT
72205LB
72215LB
72225LB
72235LB
72245LB
FIRST LOAD (
)
Vcc
IDT
72205LB
72215LB
72225LB
72235LB
72245LB
IDT
72205LB
72215LB
72225LB
72235LB
72245LB
2766 drw 23
RCLK
WCLK
RCLK
WCLK
RCLK
WCLK
Dn
Qn
Dn
Qn
Dn
Qn
DEPTH EXPANSION CONFIGURATION —
(WITH PROGRAMMABLE FLAGS)
Thesedevicescaneasilybeadaptedtoapplicationsrequiringmorethan256/
512/1,024/2,048/4,096wordsofbuffering. Figure21 showsDepthExpansion
usingthreeIDT72205LB/72215LB/72225LB/72235LB/72245LBs. Maximum
depth is limited only by signal loading. Follow these steps:
1. The first device must be designated by grounding the First Load (
FL)
control input.
2. All other devices must have
FL in the HIGH state.
3. The Write Expansion Out (
WXO) pin of each device must be tied to
the Write Expansion In (
WXI) pin of the next device. See Figure 21.
4. The Read Expansion Out (
RXO) pin of each device must be tied to the
Read Expansion In (
RXI) pin of the next device. See Figure 21.
5. All Load (
LD) pins are tied together.
6. The Half-Full Flag (
HF) is not available in this Depth Expansion
Configuration.
7.
EF, FF, PAE, and PAF are created with composite flags by ORing
together every respective flags for monitoring. The composite
PAE
and
PAF flags are not precise.
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相关代理商/技术参数 |
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| 72225LB25TFI | 制造商:Integrated Device Technology Inc 功能描述:FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 18 64-Pin STQFP 制造商:Integrated Device Technology Inc 功能描述:FIFO SYNC DUAL DEPTH/WIDTH UNI-DIR 1KX18 64TQFP - Rail/Tube |
| 72225LB25TFI8 | 制造商:Integrated Device Technology Inc 功能描述:FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 18 64-Pin STQFP T/R 制造商:Integrated Device Technology Inc 功能描述:FIFO SYNC DUAL DEPTH/WIDTH UNI-DIR 1KX18 64TQFP - Tape and Reel |
| 72226 | 制造商:Molex 功能描述: |
| 722-26 | 功能描述:高频/射频继电器 26V DC-1GHz .15W RoHS:否 制造商:Omron Electronics 触点形式:2 Form C (DPDT-BM) 触点电流额定值: 线圈电压:5 VDC 线圈类型:Non-Latching 频率: 功耗:100 mW 端接类型:Solder Terminal 绝缘:20 dB to 30 dB at 1 GHz 介入损耗:0.2 dB at 1 GHz |
| 722-26/G | 制造商:Teledyne Relays 功能描述:EM RLY DPDT 1ADC/0.25AAC 26.5VDC 2KOHM TH - Bulk |
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