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参数资料
| 型号： | 73S8024C-DB |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 17/22页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO 73S8024C 28-SOIC |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
73S8024C Data Sheet
DS_8024C_023
4
Rev. 1.3
1
Pin Description
1.1
Card Interface
Name
Pin
(SO)
Description
IO
11
Card I/O: Data signal to/from card. Includes a pull-up resistor to VCC.
AUX1
13
AUX1: Auxiliary data signal to/from card. Includes a pull-up resistor to VCC.
AUX2
12
AUX2: Auxiliary data signal to/from card. Includes a pull-up resistor to VCC.
RST
16
Card reset: provides reset (RST) signal to card.
CLK
15
Card clock: provides clock (CLK) signal to card. The rate of this clock is
determined by crystal oscillator frequency and CLKDIV selections.
PRES
10
Card Presence switch: active high indicates card is present. Includes a pull-
down current source.
PRES
9
Card Presence switch: active low indicates card is present. Includes a pull-up
current source.
VCC
17
Card power supply: logically controlled by the sequencer, output of DC-DC
converter. Requires an external filter capacitor to the card GND.
GND
14
Card ground.
1.2
Miscellaneous Inputs and Outputs
Name
Pin
(SO)
Description
XTALIN
24
Crystal oscillator input: can either be connected to crystal or driven as a source
for the card clock.
XTALOUT
25
Crystal oscillator output: connected to crystal. Left open if XTALIN is being
used as an external clock input.
VDDF_ADJ
18
VDD fault threshold adjustment input: this pin can be used to adjust the VDDF
value (that controls deactivation of the card). Must be left open if unused.
NC
7
Non-connected pin.
1.3
Power supply and ground
Name
Pin
(SO)
Description
VDD
6, 21
System controller interface supply voltage, supply voltage for internal power
supply and DC-DC converter power supply source.
GND
4
DC-DC converter ground.
GND
22
Digital ground.
LIN
5
External inductor. Connect external inductor from pin 5 to VDD. Keep the
inductor close to pin 5.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8024C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8024C-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8024RN | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Low Cost Smart Card Interface |
| 73S8024RN-20IM/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8024RN-20IM/F1 | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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