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| 型号： | 73S8024C-DB |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 2/22页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO 73S8024C 28-SOIC |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
73S8024C Data Sheet
DS_8024C_023
10
Rev. 1.3
The following steps and Figure 4 show the activation sequence and the timing of the card control signals
when the system controller pulls
CMDVCC low while RSTIN is high:
1.
CMDVCC is set low.
2.
Next, the internal VCC control circuit checks the presence of VCC at the end of t1. In normal operation,
the voltage VCC to the card becomes valid during this time. If not, OFF goes low to report a fault to
the system controller and the VCC
3.
After the fall of RSTIN at t
power to the card is shut down.
2
4.
CLK is applied to the card at the end of t
, turn I/O (AUX1, AUX2) to reception mode.
3
5.
RST is a copy of RSTIN after t
after I/O is in reception mode.
4. RSTIN may be set high before t 4, however the sequencer will not
set RST high until 42,000 clock cycles after the start of CLK.
Figure 4: Activation Sequence – RSTIN high when
CMDVCC goes low
9
Deactivation Sequence
Deactivation is initiated either by the system controller by setting the
CMDVCC high, or automatically in
the event of hardware faults. Hardware faults are over-current, overheating, VDD fault, VCC
The following steps and
fault, and card
extraction during the session.
Figure 5 show the deactivation sequence and the timing of the card control signals
when the system controller sets the
CMDVCC high or OFF goes low due to a fault or card removal:
1.
RST goes low at the end of time t1
2.
CLK is set low at the end of time t
.
2
3.
I/O goes low at the end of time t
.
3
4.
V
. Out of reception mode.
CC is turned off at the end of time t 4. After a delay t 5 (discharge of the VCC capacitor), VCC is low.
t1 = 0.510 ms (timing by 1.5MHz internal Oscillator)
t2 = 1.5 s, I/O goes to reception state
t3
≥ 0.5 s, CLK active
t4
≥ 42000 card clock cycles (time for RST to become the copy of RSTIN).
CMDVCC
VCC
IO
CLK
RSTIN
t1
t2
t3
t4
RST
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8024C-IL/F | 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16 |
| 73S8024C-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8024RN | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Low Cost Smart Card Interface |
| 73S8024RN-20IM/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8024RN-20IM/F1 | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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