参数资料
| 型号： | A3P250-FGG256 |
| 厂商： | Microsemi SoC |
| 文件页数： | 14/27页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2048MAC 157I/O 256FBGA |
| 标准包装： | 90 |
| 系列： | ProASIC3 |
| RAM 位总计： | 36864 |
| 输入/输出数： | 157 |
| 门数： | 250000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FPBGA（17x17） |
| 其它名称： | 1100-1027 |
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22 www.microsemi.com/soc
Development
Kits
SupportsSmartFusion
development, including
ARM Cortex-M3, FPGA and
programmable analog
Freeone-yearLiberoIDEsoftware
and Gold license with SoftConsole
for program and debug
5Vpowersupplyand
international adapters
TwoUSBcablesandlowcost
programming stick
User’sguide,tutorialand
design examples
PCBschematics,layoutfiles
andBOM
Boardfeatures
- Ethernet, EtherCAT, CAN, UART,
I2C and SPI interfaces
- USB port for HyperTerminal
- USB port for programming
and debug
- J-Link header for debug
- Mixed signal and A2F500 digital
expansion header
- Extensive off-chip memory
- Refer to www.microsemi.com/soc
for a full list of features
SupportsSmartFusion
cSoC evaluation, including
ARM Cortex-M3, FPGA and
programmable analog
Freeone-yearLiberoIntegrated
Design Environment (IDE) software
and Gold license with SoftConsole
for program and debug
USBprogrammingbuiltintoboard
TwoUSBcables
User’sguide,tutorialand
design examples
Printedcircuitboard(PCB)
schematics,layoutfilesand
bill-of-materials(BOM)
Boardfeatures
- Ethernet interface
- USB port for power and
HyperTerminal
- USB port for programming
and debug
- J-Link header for debug
- Mixed signal header
- SPI flash – off-chip memory
- Reset and 2 user switches, 8 LEDs
- POT for voltage / current monitor
- Temperature monitor
- Organic light-emitting diode (OLED)
Ordering Codes
Supported Devices
Price
A2F500-DEV-KIT
A2F500M3G-FGG484
$ 999
Ordering Code
Supported Device
Price
A2F-EVAL-KIT
A2F200M3F-FGG484
$ 99
Supportsdebugaccesstothe
mixed signal header of the
SmartFusion Evaluation Kit and
SmartFusion Development Kit
41/2”plasticstandoffsand
4 plastic screws to match
development kit height
Soldstandalone
Boardfeatures
- Test points for signal probing
- Mixed signal header for daughter
card support
- 100 Mil header for wire-wrapped
or soldered signals
10/100
Ethernet
Interface
Regulators
USB
Program
and Debug
Interface
SmartFusion Device
User SW2
USB
Power and
USB-UART
Interface
Potentiometer
Reset Switch
5 Debug I/Os
8 User LEDs
Debug Select
JTAG Select
OLED Display
RVI - Header
SPI-Flash
Memory
PUB Switch
VRPSM
Voltage
Option
20 MHz
Crystal
32.768 KHz
Crystal
User SW1
Mixed Signal
Header
SmartFusion Evaluation Kit
Mixed Signal Daughter Card
DirectC Header
Board Reset
Switch
Power Jack
Memory Device
Configuration
Headers
AGLP DIP
Switch
AGLP125V5-
CSG289
IGLOO PLUS
Header
10/100 Ethernet
PHY
RJ45 Connector
for 10/100 Ethernet
Power Switch
DACOUT/
ADC
Headers
RJ45 Connectors
for EtherCAT
Ports
SmartFusion
cSoC
DB9
Connector
for CAN0
SRAM
(3.3 V)
CAN
Transceivers
DB9 Connector
for CAN1
A2F500
Connector
PSRAM
(1.8 V)
LCPS Connector
DIP Switch
JTAG_SEL Switch
JTAG Chain
Configuration Header
1.5 V Header
PUB Switch
RS485 Transceiver
DB9 Connector for
RS485 (UART1)
50 MHz Oscillator
SPI Headers
I2C Headers
USB Connector
for UART0
OLED
Push-Button
Switches
RealView Header
JTAG MUX
EtherCAT
PHYs
DAC0 and DAC1
Callibration POTs
for ±15 V Bipolar
Outputs
POT for
Current
Monitor
Mixed
Signal
Header
EtherCAT
ASIC
SmartFusion Development Kit
Ordering Code
Supported Device
Price
MIXED-SIGNAL-DC
No Microsemi device
$ 55
Mixed Signal Connector
Test Points
100 mil Connector
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P250-FGG256I | 功能描述:IC FPGA 1KB FLASH 250K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3P250-FGG256T | 功能描述:IC FPGA 1KB FLASH 250K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P250-FGG256X212 | 制造商:Microsemi Corporation 功能描述: |
| A3P250-FPQ144 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P250-FPQ144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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