参数资料
| 型号： | A3P250-FGG256 |
| 厂商： | Microsemi SoC |
| 文件页数： | 22/27页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2048MAC 157I/O 256FBGA |
| 标准包装： | 90 |
| 系列： | ProASIC3 |
| RAM 位总计： | 36864 |
| 输入/输出数： | 157 |
| 门数： | 250000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FPBGA（17x17） |
| 其它名称： | 1100-1027 |
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4 www.microsemi.com/soc
SmartFusion
The customizable system-on-chip (cSoC) device
SmartFusion cSoCs are the only devices that integrate FPGA fabric, an ARM Cortex-M3 processor and programmable analog, offering full customization, IP
protection and ease-of-use. Based on Microsemi’s proprietary flash process, SmartFusion cSoCs are ideal for hardware and embedded designers who need a true
system-on-chip that gives more flexibility than traditional fixed-function microcontrollers without the excessive cost of soft processor cores on traditional FPGAs.
Availableincommercial,industrial
and military* grades
Hard100MHz32-bitARM
Cortex-M3 CPU
Multi-layerAHBcommunications
matrixwithupto16Gbpsthroughput
10/100EthernetMAC
Twoperipheralsofeachtype:
SPI,I2C,UART,and32-bittimers
Upto512KBflashand
64KBSRAM
Externalmemorycontroller(EMC)
8-channelDMAcontroller
Integratedanalog-to-digital
converters (ADCs) and digital-
to-analog converters (DACs)
with1percentaccuracy
On-chipvoltage,currentand
temperature monitors
Uptoten15nshigh-speed
comparators
Analogcomputeengine(ACE)
offloadsCPUfromanalog
processing
Upto35analogI/Osand
169digitalGPIOs
* Under development
SmartFusion Devices
Notes:
1. Not available on A2F500 for the PQ208 package.
2. Two PLLs are available in CS288 and FG484 (one PLL in FG256 and PQ208).
3. These functions share I/O pins and may not all be available at the same time.
4. Available on FG484 only. PQ208, FG256, and CS288 packages offer the same programmable analog capabilities as A2F200.
Notes:
1. These pins are shared between direct analog inputs to the ADCs and voltage/current/temperature monitors.
2. 16 MSS I/Os are multiplexed and can be used as FPGA I/Os, if not needed for the MSS. These I/Os support Schmitt triggers and support only LVTTL and LVCMOS (1.5 / 1.8 / 2.5, 3.3 V) standards.
3. 9 MSS I/Os are primarily for 10/00 Ethernet MAC and are also multiplexed and can be used as FPGA I/Os if Ethernet MAC is not used in a design. These I/Os support Schmitt triggers and support only LVTTL and LVCMOS
(1.5 / 1.8 / 2.5, 3.3 V) standards.
4. 10/100 Ethernet MAC is not available on A2F060.
5. EMC is not available on the A2F500 PQ208 package.
Package I/Os: MSS + FPGA I/Os
SmartFusion Devices
A2F060
A2F200
A2F500
FPGA Fabric
System Gates
60,000
200,000
500,000
Tiles (D-flip-flops)
1,536
4,608
11,520
RAM Blocks (4,608 bits)
8
24
Microcontroller
Subsystem (MSS)
Flash (Kbytes)
128
256
512
SRAM (Kbytes)
16
64
Cortex-M3 with
Memory Protection Unit (MPU)
Yes
10/100 Ethernet MAC
No
Yes
External Memory Controller (EMC)
24-bit address, 16-bit data
24-bit address, 16-bit data1
DMA
8 Ch
I2C
2
SPI
2
16550 UART
2
32-Bit Timer
2
PLL
1
22
32 KHz Low Power Oscillator
1
100 MHz On-Chip RC Oscillator
1
Main Oscillator (32 KHz to 20 MHz)
1
Programmable
Analog
ADCs (8-/10-/12-bit SAR)
1
2
34
DACs (12-bit sigma-delta)
1
2
34
Signal Conditioning Blocks (SCBs)
1
4
54
Comparators3
2
8
104
Current Monitors3
1
4
54
Temperature Monitors3
1
4
54
Bipolar High Voltage Monitors3
2
8
104
Device
A2F060
A2F200
A2F500
TQ144
CS288
FG256
PQ208
CS288
FG256
FG484
PQ208
CS288
FG256
FG484
Direct Analog Input
11
8
12
Shared Analog Input1
4
16
20
Total Analog Input
15
24
32
Total Analog Output
1
2
1
2
3
MSS I/Os2,3
214
284
264
22
31
25
41
22
31
25
41
FPGA I/Os
33
68
66
78
66
94
665
78
66
128
Total I/Os
70
112
108
113
135
117
161
113
135
117
204
SmartFusion
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P250-FGG256I | 功能描述:IC FPGA 1KB FLASH 250K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3P250-FGG256T | 功能描述:IC FPGA 1KB FLASH 250K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P250-FGG256X212 | 制造商:Microsemi Corporation 功能描述: |
| A3P250-FPQ144 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P250-FPQ144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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