参数资料
| 型号： | A3P250-FGG256 |
| 厂商： | Microsemi SoC |
| 文件页数： | 17/27页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 2048MAC 157I/O 256FBGA |
| 标准包装： | 90 |
| 系列： | ProASIC3 |
| RAM 位总计： | 36864 |
| 输入/输出数： | 157 |
| 门数： | 250000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FPBGA（17x17） |
| 其它名称： | 1100-1027 |
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www.microsemi.com/soc
Development
Kits
Allowsuserstoevaluate
the functionality of Microsemi’s
Core1553BRMwithouthavingto
createacompleteMIL-STD-1553B
compliant system
FusionAdvancedDevelopmentKit
with two 9 V power supplies
Core1553daughtercard
User’sguide,tutorialand
design example
PCBschematics,layoutfiles
andBOM
Purchasingthekitgivestheowner
therighttotheprogrammingfile
of the demo, but not an evaluation
of the IP. The IP evaluation or
purchase is quoted separately.
Boardfeatures
- MIL-STD-1553B transceiver, two
transformers and two concentric
twinax connectors included on
the Core1553 daughter board
~ MIL-STD-1553B concentric
twinax connectors are center
pin signal high and cylindrical
contact signal low
~ Connectivity is
MIL-C-49142 compliant
~ Evaluate and develop
medium speed on-board data
communications bus solutions
for MIL-STD-1553B /
UK DEF-STAN 00-18 (Pt.2) /
NATO STANAG 3838 AVS /
Avionic Standards Coordinating
Committee Air-Std 50/2
- CAN bus interface support
- Connector to ARINC 429
Daughter Board (CORE429-SA)
Fusion Advanced Development Kit
Core1553-SA
Core1553 Development Kit
Hardware Summary
Ordering Code
Description
Price
CORE1553-DEV-KIT
Core1553 Development Kit
$ 3,620
CORE1553-SA
Core1553 daughter card
$ 2,900
M1AFS-ADV-DEV-KIT-PWR
M1AFS-ADV-DEV-KIT with two 9 V power packs
$ 750
Family
Ordering Code
Name
Device
Price
Power
SmartFusion
A2F-EVAL-KIT*
SmartFusion Evaluation Kit
A2F200M3F-FGG484
$ 99
USB
SmartFusion
A2F500-DEV-KIT
SmartFusion Development Kit
A2F500M3G-FGG484
$ 999
5 V
SmartFusion
MPM-DC-KIT
MPM Daughter Card
none
$ 299
9 V
SmartFusion
MIXED-SIGNAL-DC
Mixed Signal Daughter Card
none
$ 55
N/A
Fusion
M1AFS-EMBEDDED-KIT*
Fusion Embedded Development Kit
M1AFS1500-FGG484
$ 250
USB / 5 V
Fusion
AFS-EVAL-KIT
Fusion Starter Kit
AFS600-FG256
$ 500
9 V
Fusion
M1AFS-ADV-DEV-KIT-PWR
Fusion Advanced Development Kit
M1AFS1500-FGG484
$ 750
9 V
IGLOO
AGLN-NANO-KIT*
IGLOO nano Starter Kit
AGLN250V2-ZVQG100
$ 99
USB
IGLOO
AGL-ICICLE-KIT
IGLOO Icicle Evaluation Kit
AGL125V2-QNG132
$ 150
USB
IGLOO
AGLP-EVAL-KIT
IGLOO PLUS Starter Kit
AGLP125V2-CSG289
$ 299
5 V
IGLOO
M1AGL1000-DEV-KIT
ARM Cortex-M1 IGLOO Development Kit
M1AGL1000V2-FGG484
$ 550
5 V
ProASIC3
A3PE-PROTO-KIT*
ProASIC3 Starter Kit
A3PE1500-PQ208
$ 665
9 V
ProASIC3
M1A3PL-DEV-KIT
ARM Cortex-M1 ProASIC3L Development Kit
M1A3P1000L-FGG484
$ 550
5 V
*Most recommended Kit for each product family
Microsemi offers hardware choices for terrestrial products. Most popular kits are listed in the table and shown in further detail in this section. Full details of these
kits can also be found online with user’s guides and accompanying tutorials.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| A3P250-FGG256I | 功能描述:IC FPGA 1KB FLASH 250K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3P250-FGG256T | 功能描述:IC FPGA 1KB FLASH 250K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA（17x17） |
| A3P250-FGG256X212 | 制造商:Microsemi Corporation 功能描述: |
| A3P250-FPQ144 | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
| A3P250-FPQ144ES | 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3 Flash Family FPGAs |
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