参数资料
型号: A3PN250-Z1VQG100I
厂商: Microsemi SoC
文件页数: 32/114页
文件大小: 0K
描述: IC FPGA NANO 250K GATES 100-VQFP
标准包装: 90
系列: ProASIC3 nano
RAM 位总计: 36864
输入/输出数: 68
门数: 250000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 100-TQFP
供应商设备封装: 100-VQFP(14x14)
ProASIC3 nano DC and Switching Characteristics
2-10
Revision 11
Combinatorial Cells Contribution—PC-CELL
PC-CELL = NC-CELL* 1 / 2 * PAC7 * FCLK
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-12 on page 2-11.
FCLK is the global clock signal frequency.
Routing Net Contribution—PNET
PNET = (NS-CELL + NC-CELL) * 1 / 2 * PAC8 * FCLK
NS-CELL is the number of VersaTiles used as sequential modules in the design.
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-12 on page 2-11.
FCLK is the global clock signal frequency.
I/O Input Buffer Contribution—PINPUTS
PINPUTS = NINPUTS * 2 / 2 * PAC9 * FCLK
NINPUTS is the number of I/O input buffers used in the design.
2 is the I/O buffer toggle rate—guidelines are provided in Table 2-12 on page 2-11.
FCLK is the global clock signal frequency.
I/O Output Buffer Contribution—POUTPUTS
POUTPUTS = NOUTPUTS * 2 / 2 * 1 * PAC10 * FCLK
NOUTPUTS is the number of I/O output buffers used in the design.
2 is the I/O buffer toggle rate—guidelines are provided in Table 2-12 on page 2-11.
1 is the I/O buffer enable rate—guidelines are provided in Table 2-13 on page 2-11.
FCLK is the global clock signal frequency.
RAM Contribution—PMEMORY
PMEMORY = PAC11 * NBLOCKS * FREAD-CLOCK * 2 + PAC12 * NBLOCK * FWRITE-CLOCK * 3
NBLOCKS is the number of RAM blocks used in the design.
FREAD-CLOCK is the memory read clock frequency.
2 is the RAM enable rate for read operations.
FWRITE-CLOCK is the memory write clock frequency.
3 is the RAM enable rate for write operations—guidelines are provided in Table 2-13 on page 2-11.
PLL Contribution—PPLL
PPLL = PDC4 + PAC13 * FCLKOUT
FCLKOUT is the output clock frequency.1
1.
The PLL dynamic contribution depends on the input clock frequency, the number of output clock signals generated by the
PLL, and the frequency of each output clock. If a PLL is used to generate more than one output clock, include each output
clock in the formula by adding its corresponding contribution (PAC14 * FCLKOUT product) to the total PLL contribution.
相关PDF资料
PDF描述
HMM43DRYS CONN EDGECARD 86POS DIP .156 SLD
HSM36DRAS CONN EDGECARD 72POS R/A .156 SLD
HMM36DRAS CONN EDGECARD 72POS R/A .156 SLD
HMC35DRYS-S93 CONN EDGECARD 70POS DIP .100 SLD
HBC65DRYS-S93 CONN EDGECARD 130PS DIP .100 SLD
相关代理商/技术参数
参数描述
A3PN250-Z2VQ100 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN250-Z2VQ100I 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN250-Z2VQG100 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN250-Z2VQG100I 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)
A3PN250-ZVQ100 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA,CSBGA 供应商设备封装:289-CSP(14x14)