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参数资料
| 型号： | A3PN250-Z1VQG100I |
| 厂商： | Microsemi SoC |
| 文件页数： | 11/114页 |
| 文件大小： | 0K |
| 描述： | IC FPGA NANO 250K GATES 100-VQFP |
| 标准包装： | 90 |
| 系列： | ProASIC3 nano |
| RAM 位总计： | 36864 |
| 输入/输出数： | 68 |
| 门数： | 250000 |
| 电源电压： | 1.425 V ~ 1.575 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 100-TQFP |
| 供应商设备封装： | 100-VQFP（14x14） |
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Datasheet Information
5-2
Revision 11
Revision 9
(continued)
The reference to guidelines for global spines and VersaTile rows, given in the "Global
Clock Contribution—PCLOCK" section, was corrected to t
he "Spine Architecture"
section of the Global Resources chapter in the IProASIC3 nano FPGA Fabric
User's Guide (SAR 34736).
Figure 2-3 has been modified for the DIN waveform; the Rise and Fall time label has
been changed to tDIN (37114).
The notes regarding drive strength in the "Summary of I/O Timing Characteristics –
tables were revised for clarification. They now state that the minimum drive strength
for the default software configuration when run in wide range is ±100 A. The drive
strength displayed in software is supported in normal range only. For a detailed I/V
curve, refer to the IBIS models (SAR 34759).
The AC Loading figures in the "Single-Ended I/O Characteristics" section were
updated to match tables in the "Summary of I/O Timing Characteristics – Default I/O
Software Settings" section (SAR 34888).
Added values for minimum pulse width and removed the FRMAX row from Table 2-67
through Table 2-72 in the "Global Tree Timing Characteristics" section. Use the
software to determine the FRMAX for the device you are using (SAR 36956).
through
Table 2-73 ProASIC3 nano CCC/PLL Specification was updated. A note was added
indicating that when the CCC/PLL core is generated by Microsemi core generator
software, not all delay values of the specified delay increments are available (SAR
34823).
The port names in the SRAM "Timing Waveforms", SRAM "Timing Characteristics"
tables, Figure 2-34 FIFO Reset, and the FIFO "Timing Characteristics" tables were
revised to ensure consistency with the software names (SAR 35743).
Reference was made to a new application note, Simultaneous Read-Write Operations
in Dual-Port SRAM for Flash-Based cSoCs and FPGAs, which covers these cases in
detail (SAR 34871).
The "Pin Descriptions and Packaging" chapter has been added (SAR 34772).
July 2010
The versioning system for datasheets has been changed. Datasheets are assigned a
revision number that increments each time the datasheet is revised. The "ProASIC3
nano Device Status" table on page II indicates the status for each device in the device
family.
N/A
Revision 8
(April 2010)
References to differential inputs were removed from the datasheet, since ProASIC3
nano devices do not support differential inputs (SAR 21449).
N/A
The "ProASIC3 nano Device Status" table is new.
The JTAG DC voltage was revised in Table 2-2 Recommended Operating
Conditions 1, 2 (SAR 24052). The maximum value for VPUMP programming voltage
(operation mode) was changed from 3.45 V to 3.6 V (SAR 25220).
The highest temperature in Table 2-6 Temperature and Voltage Derating Factors for
Timing Delays was changed to 100C.
The typical value for A3PN010 was revised in Table 2-7 Quiescent Supply Current
Characteristics. The note was revised to remove the statement that values do not
include I/O static contribution.
Revision
Changes
Page
相关PDF资料 |
PDF描述 |
|---|---|
| HMM43DRYS | CONN EDGECARD 86POS DIP .156 SLD |
| HSM36DRAS | CONN EDGECARD 72POS R/A .156 SLD |
| HMM36DRAS | CONN EDGECARD 72POS R/A .156 SLD |
| HMC35DRYS-S93 | CONN EDGECARD 70POS DIP .100 SLD |
| HBC65DRYS-S93 | CONN EDGECARD 130PS DIP .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A3PN250-Z2VQ100 | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN250-Z2VQ100I | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN250-Z2VQG100 | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN250-Z2VQG100I | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
| A3PN250-ZVQ100 | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3 nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14） |
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