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参数资料
| 型号： | A54SX08P-PQ208M |
| 厂商： | Electronic Theatre Controls, Inc. |
| 元件分类： | FPGA |
| 英文描述： | 54SX Family FPGAs |
| 中文描述： | 54SX家庭的FPGA |
| 文件页数： | 21/57页 |
| 文件大小： | 415K |
| 代理商： | A54SX08P-PQ208M |
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v3.1
21
5 4 S X F a m ily F P G A s
J unc t ion T e m pe ra t ure (T
J
)
The temperature that you select in Designer Series software
is the junction temperature, not ambient temperature. This
is an important distinction because the heat generated from
dynamic power consumption is usually hotter than the
ambient temperature. Use the equation below to calculate
junction temperature.
Junction Temperature =
T + T
a
Where:
T
a
= Ambient Temperature
T = Temperature gradient between junction (silicon) and
ambient
T =
θ
ja
* P
P = Power calculated from Estimating Power Consumption
section
θ
ja
= Junction to ambient of package.
θ
ja
numbers are
located in Package Thermal Characteristics section.
P a c k a g e T he rm a l C ha ra c t e ris t ic s
The device junction to case thermal characteristic is
θ
jc
,
and the junction to ambient air characteristic is
θ
ja
. The
thermal characteristics for
θ
ja
are shown with two different
air flow rates.
The maximum junction temperature is 150
°
C.
A sample calculation of the absolute maximum power
dissipation allowed for a TQFP 176-pin package at
commercial temperature and still air is as follows:
Package Type
Pin Count
θ
jc
12
11
11
10
8
3.8
3
3
3
3.8
θ
ja
Still Air
θ
ja
300 ft/min
Units
Plastic Leaded Chip Carrier (PLCC)
Thin Quad Flat Pack (TQFP)
Thin Quad Flat Pack (TQFP)
Very Thin Quad Flatpack (VQFP)
Plastic Quad Flat Pack (PQFP) without Heat Spreader
Plastic Quad Flat Pack (PQFP) with Heat Spreader
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Plastic Ball Grid Array (PBGA)
Fine Pitch Ball Grid Array (FBGA)
Note:
SX08 does not have a heat spreader.
84
144
176
100
208
208
272
313
329
144
32
32
28
38
30
20
20
23
18
38.8
22
24
21
32
23
17
14.5
17
13.5
26.7
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
Maximum Power Allowed
ja
(°C/W)
Max. junction temp. (°C) – Max. ambient temp. (°C)
28°C/W
150°C – 70°C
2.86W
=
=
=
相关PDF资料 |
PDF描述 |
|---|---|
| A54SX08P-PQ208PP | LM1881 Video Sync Separator; Package: SOIC NARROW; No of Pins: 8 |
| A54SX08P-TQ208 | LM1881 Video Sync Separator; Package: MDIP; No of Pins: 8; Qty per Container: 40; Container: Rail |
| A54SX08P-TQ208I | LM1894 Dynamic Noise Reduction System DNR®; Package: SOIC NARROW; No of Pins: 14; Qty per Container: 55; Container: Rail |
| A54SX08P-TQ208M | 54SX Family FPGAs |
| A54SX08P-TQ208PP | 54SX Family FPGAs |
相关代理商/技术参数 |
参数描述 |
|---|---|
| A54SX08P-PQ208PP | 制造商:未知厂家 制造商全称:未知厂家 功能描述:54SX Family FPGAs |
| A54SX08-PQ208 | 功能描述:IC FPGA SX 12K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A54SX08-PQ208I | 功能描述:IC FPGA SX 12K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA（27X27） |
| A54SX08-PQ208M | 制造商:未知厂家 制造商全称:未知厂家 功能描述:54SX Family FPGAs |
| A54SX08-PQ208PP | 制造商:未知厂家 制造商全称:未知厂家 功能描述:54SX Family FPGAs |
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