参数资料
型号: ACS8946
元件分类: 数字传输电路
英文描述: ATM/SONET/SDH SUPPORT CIRCUIT, QCC48
封装: 7 X 7 MM, QFN-48
文件页数: 31/40页
文件大小: 663K
代理商: ACS8946
ADVANCED COMMUNICATIONS
FINAL
DATASHEET
Revision 3/November 2006 Semtech Corp.
Page 37
www.semtech.com
ACS8946 JAM PLL
Thermal Conditions
The device is rated for full temperature range when this
package is used with a 4-layer or more PCB. Copper
coverage must exceed 50%. All pins must be soldered to
the PCB. Maximum operating temperature must be
reduced when the device is used with a PCB with less than
these requirements.
As the device includes a large thermal die paddle ground
connection which must be soldered to the PCB in addition
to the pins, giving improved pull-off strength and thermal
dissipation characteristics as well as the necessary
grounding.
Although not essential for the ACS8946, one technique
that may be used to improve heat dissipation from
through the large centre pad is to include a thermal
landing the same size as the centre pad on the
component side of the board (and one on the opposite
side of the PCB) connected to analog ground using a
number of thermal vias, approximately 0.33 mm
diameter. These vias should be completely connected
(flooded over) to the thermal landing(s) as well as to
internal ground planes if using a multi-layer PCB. 3 x 3
vias pitched at 1.27 mm between via centres would be
more than sufficient for the ACS8946 if this method were
adopted.
Figure 22 Typical 48 Pin QFN PCB Footprint
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