参数资料
型号: AD5737ACPZ
厂商: Analog Devices Inc
文件页数: 2/44页
文件大小: 0K
描述: IC DAC QUAD 12BIT CUR 64-LFCSP
标准包装: 1
设置时间: 15µs
位数: 12
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 4
电压电源: 模拟和数字
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 托盘
输出数目和类型: 4 电流,单极
采样率(每秒): *
AD5737
Data Sheet
Rev. C | Page 10 of 44
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 4.
Parameter
Rating
AV
DD, VBOOST_x to AGND, DGND
0.3 V to +33 V
AV
CC to AGND
0.3 V to +7 V
DV
DD to DGND
0.3 V to +7 V
Digital Inputs to DGND
0.3 V to DV
DD + 0.3 V or +7 V
(whichever is less)
Digital Outputs to DGND
0.3 V to DV
DD + 0.3 V or +7 V
(whichever is less)
REFIN, REFOUT to AGND
0.3 V to AV
DD + 0.3 V or +7 V
(whichever is less)
I
OUT_x to AGND
AGND to V
BOOST_x or 33 V if
using the dc-to-dc converter
SW
x to AGND
0.3 V to +33 V
AGND, GNDSW
x to DGND
0.3 V to +0.3 V
Operating Temperature Range (T
A)
Industrial1
40°C to +105°C
Storage Temperature Range
65°C to +150°C
Junction Temperature (T
J max)
125°C
Power Dissipation
(T
J max TA)/θJA
Lead Temperature
JEDEC industry standard
Soldering
J-STD-020
1 Power dissipated on chip must be derated to keep the junction temperature
below 125°C.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for a JEDEC
4-layer test board.
Table 5. Thermal Resistance
Package Type
θ
JA
Unit
64-Lead LFCSP (CP-64-3)
28
°C/W
ESD CAUTION
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