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参数资料
| 型号： | AD6657BBCZ |
| 厂商： | ANALOG DEVICES INC |
| 元件分类： | 无绳电话/电话 |
| 英文描述： | Quad IF Receiver; Package: Chip Scale BGA; No of Pins: 144; Temperature Range: Ind |
| 中文描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA144 |
| 封装： | 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, MO-205AC, CSPBGA-144 |
| 文件页数： | 32/32页 |
| 文件大小： | 1021K |
| 代理商： | AD6657BBCZ |
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AD6657
Rev. A | Page 9 of 32
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter
Rating
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0 V
VIN+x, VINx to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to AVDD + 0.2 V
SYNC to AGND
0.3 V to AVDD + 0.2 V
VCMx to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.2 V
SCLK to AGND
0.3 V to DRVDD + 0.2 V
SDIO to AGND
0.3 V to DRVDD + 0.2 V
PDWN to AGND
0.3 V to DRVDD + 0.2 V
MODE to AGND
0.3 V to DRVDD + 0.2 V
Digital Outputs to AGND
0.3 V to DRVDD + 0.2 V
DCO+AB, DCOAB, DCO+CD,
DCOCD to AGND
0.3 V to DRVDD + 0.2 V
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
The values in Table 7 are per JEDEC JESD51-7 plus JEDEC
JESD25-5 for a 2S2P test board. Typical θJA is specified for a
4-layer PCB with a solid ground plane. As shown in Table 7,
airflow improves heat dissipation, which reduces θJA. In addi-
tion, metal in direct contact with the package leads from metal
traces, through holes, ground, and power planes reduces θJA.
Table 7.
Package Type
Airflow
Velocity
θJA1
θJC2
θJB3
Unit
0 m/s
26.9
8.9
6.6
1 m/s
24.2
144-Ball CSP_BGA,
10 mm × 10 mm
(BC-144-1)
2.5 m/s
23.0
°C/W
1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
2 Per MIL-STD 883, Method 1012.1.
3 Per JEDEC JESD51-8 (still air).
The values in Table 8 are from simulations. The PCB is a JEDEC
multilayer board. Thermal performance for actual applications
requires careful inspection of the conditions in the application
to determine whether they are similar to those assumed in these
calculations.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 8.
Package Type
Airflow
Velocity
Ψ
JB
Ψ
JT
Unit
0 m/s
14.4
0.23
1 m/s
14.0
0.50
144-Ball CSP_BGA,
10 mm × 10 mm
(BC-144-1)
2.5 m/s
13.9
0.53
°C/W
ESD CAUTION
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