参数资料
| 型号： | AD8384ASVZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 19/24页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER LCD 6CH 10BIT 80-TQFP |
| 产品变化通告： | AD8384ASVZ Discontinuation 28/Feb/2012 |
| 标准包装： | 1 |
| 系列： | DecDriver™ |
| 显示器类型： | LCD |
| 接口： | 3 线串口 |
| 电流 - 电源： | 40mA |
| 电源电压： | 9 V ~ 18 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 80-TQFP 裸露焊盘 |
| 供应商设备封装： | 80-TQFP-EP（12x12） |
| 包装： | 托盘 |
AD8384
PCB DESIGN FOR OPTIMIZED THERMAL
PERFORMANCE
The AD8384’s total maximum power dissipation is partly load
dependent. In a 6-channel 60Hz XGA system running at a
65 MHz clock rate, the total maximum power dissipation is
1.6 W at a 150 pF LCD input capacitance.
At a clock rate of 100 MHz, the total maximum power
dissipation can exceed 2 W, as shown in Table 14, for a black-to-
white video output voltage swing of 4 V and 5 V.
Table 14. Power Dissipation
A thermally effective PCB must incorporate two thermal pads
and a thermal via structure. The thermal pad on the top surface
of the PCB provides a solderable contact surface on the top
surface of the PCB. The thermal pad on the bottom PCB layer
provides a surface in direct contact with the ambient. The
thermal via structure provides a thermal path to the inner and
bottom layers of the PCB to remove heat.
THERMAL PAD DESIGN
To minimize thermal performance degradation of production
PCBs, the contact area between the thermal pad and the PCB
should be maximized. Therefore, the size of the thermal pad on
V SWING = 5 V
V SWING = 4 V
the top PCB layer should match the exposed paddle. The second
C LOAD
(pF)
150
200
250
300
P QUIESCENT
(W)
1.12
1.12
1.12
1.12
P DYNAMIC
(W)
0.82
1.01
1.21
1.41
P TOTAL
(W)
1.94
2.13
2.33
2.53
P DYNAMIC
(W)
0.71
0.86
1.01
1.17
P TOTAL
(W)
1.83
1.98
2.13
2.29
thermal pad of the same size should be placed on the bottom
side of the PCB. At least one thermal pad should be in direct
thermal contact with an external plane such as AVCC or GND.
THERMAL VIA STRUCTURE DESIGN
Effective heat transfer from the top to the inner and bottom
layers of the PCB requires thermal vias incorporated into the
Although the maximum safe operating junction temperature is
higher, the AD8384 is 100% tested at a junction temperature of
125°C. Consequently, the maximum guaranteed operating
junction temperature is 125°C. To limit the maximum junction
temperature at or below the guaranteed maximum, the package,
in conjunction with the PCB, must effectively conduct heat
thermal pad design. Thermal performance increases
logarithmically with the number of vias.
Near optimum thermal performance of production PCBs is
attained only when tightly spaced thermal vias are placed on the
full extent of the thermal pad.
away from the junction.
The AD8384 package is designed to provide enhanced thermal
characteristics through the exposed die paddle on the bottom
surface of the package. In order to take full advantage of this
feature, the exposed paddle must be in direct thermal contact
with the PCB, which then serves as a heat sink.
Rev. 0 | Page 19 of 24
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD8385 | 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 12-Channel Decimating LCD DECDRIVER with Level Shifters |
| AD8385ASVZ | 制造商:Analog Devices 功能描述: |
| AD8386 | 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 12-Channel Output Decimating LCD Driver |
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