参数资料
| 型号： | AD8384ASVZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 20/24页 |
| 文件大小： | 0K |
| 描述： | IC DRIVER LCD 6CH 10BIT 80-TQFP |
| 产品变化通告： | AD8384ASVZ Discontinuation 28/Feb/2012 |
| 标准包装： | 1 |
| 系列： | DecDriver™ |
| 显示器类型： | LCD |
| 接口： | 3 线串口 |
| 电流 - 电源： | 40mA |
| 电源电压： | 9 V ~ 18 V |
| 工作温度： | 0°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 80-TQFP 裸露焊盘 |
| 供应商设备封装： | 80-TQFP-EP（12x12） |
| 包装： | 托盘 |
AD8384
AD8384 PCB DESIGN RECOMMENDATIONS
14 mm
6 mm
Top PCB Layer
Land Pattern Dimensions
Pad Size: 0.6 mm × 0.25 mm
Pad Pitch: 0.5 mm
Thermal Pad Size: 6 mm × 6 mm
Thermal via structure: 0.25 mm to 0.35 mm diameter via holes on
a 0.5 mm to 1.0 mm grid.
LAND PATTERN – TOP LAYER
Figure 21. Land Pattern—Top Layer
6 mm
Bottom PCB Layer
Thermal Pad and Thermal Via Connections
The thermal pad on the solder side is connected to a plane. Use of
thermal spokes is not recommended when connecting the thermal
pads or via structure to the plane.
LAND PATTERN – BOTTOM LAYER
Figure 22. Land Pattern—Bottom Layer
Solder Masking
Solder masking of the via holes on the top layer of the PCB plugs
the via holes, inhibiting solder flow into the holes. To minimize the
formation of solder voids due to solder flowing into the via holes
(solder wicking), the via diameter should be made small and an
optional solder mask may be used. To optimize thermal pad
coverage, the solder mask’s diameter should be no more than
0.1 mm larger than the via hole diameter.
Solder Mask—Top Layer
Pads: Set by the customer’s PCB design rules.
Thermal Via Holes: Circular mask, centered on the via holes.
Diameter of the mask should be 0.1 mm larger than the via hole
diameter.
Solder Mask—Bottom Layer
Set by customer’s PCB design rules.
Rev. 0 | Page 20 of 24
SOLDER MASK – TOP LAYER
Figure 23. Solder Mask—Top Layer
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相关代理商/技术参数 |
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| AD8385 | 制造商:AD 制造商全称:Analog Devices 功能描述:10-Bit, 12-Channel Decimating LCD DECDRIVER with Level Shifters |
| AD8385ASVZ | 制造商:Analog Devices 功能描述: |
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