- 您现在的位置：买卖IC网 > PDF目录10115 > AD9233BCPZRL7-105 (Analog Devices Inc)IC ADC 12BIT 105MSPS 48-LFCSP PDF资料下载
参数资料
| 型号： | AD9233BCPZRL7-105 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 20/44页 |
| 文件大小： | 0K |
| 描述： | IC ADC 12BIT 105MSPS 48-LFCSP |
| 标准包装： | 750 |
| 位数： | 12 |
| 采样率（每秒）： | 105M |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 350mW |
| 电压电源： | 单电源 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 48-LFCSP-VQ（7x7） |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 2 个单端，单极；1 个差分，单极 |
| 配用： | AD9233-125EBZ-ND - BOARD EVALUATION FOR AD9233 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页当前第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页
AD9233
Rev. A | Page 27 of 44
LAYOUT CONSIDERATIONS
POWER AND GROUND RECOMMENDATIONS
When connecting power to the AD9233, it is recommended
that two separate supplies be used: one for analog (AVDD, 1.8 V
nominal) and one for digital (DRVDD, 1.8 V to 3.3 V nominal).
If only a single 1.8 V supply is available, then it should be routed
to AVDD first, then tapped off and isolated with a ferrite bead
or filter choke with decoupling capacitors preceding its con-
nection to DRVDD. The user can employ several different
decoupling capacitors to cover both high and low frequencies.
These should be located close to the point of entry at the PC
board level and close to the parts with minimal trace length.
A single PC board ground plane should be sufficient when
using the AD9233. With proper decoupling and smart parti-
tioning of the analog, digital, and clock sections of the board,
optimum performance is easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is required that the exposed paddle on the underside of the
ADC is connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9233. An
exposed, continuous copper plane on the PCB should mate to
the AD9233 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder filled or plugged.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous plane by overlaying a silkscreen
on the PCB into several uniform sections. This provides several
tie points between the two during the reflow process. Using one
continuous plane with no partitions only guarantees one tie
point between the ADC and PCB. See Figure 58 for a PCB
layout example. For detailed information on packaging and the
PCB layout of chip scale packages, see Application Note AN-772,
A Design and Manufacturing Guide for the Lead Frame Chip
Scale Package (LFCSP).
SILKSCREEN PARTITION
PIN 1 INDICATOR
0
549
2-
0
54
Figure 58. Typical PCB Layout
CML
The CML pin should be decoupled to ground with a 0.1 μF
capacitor, as shown in Figure 38.
RBIAS
The AD9233 requires the user to place a 10 kΩ resistor between
the RBIAS pin and ground. This resister sets the master current
reference of the ADC core and should have at least a 1% tolerance.
REFERENCE DECOUPLING
The VREF pin should be externally decoupled to ground with a
low ESR 1.0 μF capacitor in parallel with a 0.1 μF ceramic low
ESR capacitor. In all reference configurations, REFT and REFB
are bypass points provided for reducing the noise contributed
by the internal reference buffer. It is recommended to place an
external 0.1 μF ceramic capacitor across REFT/REFB. While it is
not required to place this 0.1 μF capacitor, the SNR performance
will degrade by approximately 0.1 dB without it. All reference
decoupling capacitors should be placed as close to the ADC as
possible with minimal trace lengths.
相关PDF资料 |
PDF描述 |
|---|---|
| IDT72221L25J8 | IC FIFO SYNC 1KX9 25NS 32PLCC |
| MS27484T16A26PA | CONN PLUG 26POS STRAIGHT W/PINS |
| MS3476W14-12P | CONN PLUG 12POS STRAIGHT W/PINS |
| IDT72215LB25PF8 | IC FIFO 512X18 SYNC 25NS 64-TQFP |
| MS27473E16F35PB | CONN PLUG 55POS STRAIGHT W/PINS |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD9233BCPZRL7-125 | 功能描述:IC ADC 12BIT 125MSPS 48-LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1 系列:- 位数:14 采样率（每秒）:83k 数据接口:串行，并联 转换器数目:1 功率耗散（最大）:95mW 电压电源:双 ± 工作温度:0°C ~ 70°C 安装类型:通孔 封装/外壳:28-DIP（0.600"，15.24mm） 供应商设备封装:28-PDIP 包装:管件 输入数目和类型:1 个单端，双极 |
| AD9233BCPZRL7-80 | 制造商:AD 制造商全称:Analog Devices 功能描述:12-Bit, 80 MSPS/105 MSPS/125 MSPS, 1.8 V Analog-to-Digital Converter |
| AD9234-1000EBZ | 功能描述:AD9234 - 12 Bit 1G Samples per Second Analog to Digital Converter (ADC) Evaluation Board 制造商:analog devices inc. 系列:- 零件状态:有效 A/D 转换器数:2 位数:12 采样率（每秒）:1G 数据接口:JESD204B 输入范围:1.34 Vpp 不同条件下的功率（典型值）:3W @ 1GSPS 使用的 IC/零件:AD9234 所含物品:板 标准包装:1 |
| AD9234BCPZ-1000 | 功能描述:IC ADC 12BIT 1GSPS 64LFCSP 制造商:analog devices inc. 系列:- 包装:托盘 零件状态:在售 位数:12 采样率（每秒）:1G 输入数:2 输入类型:差分 数据接口:JESD204B 配置:S/H-ADC 无线电 - S/H:ADC:1:1 A/D 转换器数:1 架构:管线 参考类型:内部 电压 - 电源，模拟:1.22 V ~ 1.28 V，2.44 V ~ 2.56 V 电压 - 电源，数字:1.22 V ~ 1.28 V 特性:- 工作温度:-40°C ~ 85°C 封装/外壳:64-WFQFN 裸露焊盘 供应商器件封装:64-LFCSP-WQ（9x9） 标准包装:1 |
| AD9234BCPZRL7-1000 | 功能描述:IC ADC 12BIT 1GSPS 64LFCSP 制造商:analog devices inc. 系列:- 包装:带卷（TR） 零件状态:在售 位数:12 采样率（每秒）:1G 输入数:2 输入类型:差分 数据接口:JESD204B 配置:S/H-ADC 无线电 - S/H:ADC:1:1 A/D 转换器数:1 架构:管线 参考类型:内部 电压 - 电源，模拟:1.22 V ~ 1.28 V，2.44 V ~ 2.56 V 电压 - 电源，数字:1.22 V ~ 1.28 V 特性:- 工作温度:-40°C ~ 85°C 封装/外壳:64-VFQFN 裸露焊盘，CSP 供应商器件封装:64-LFCSP-VQ（9x9） 标准包装:750 |
发布紧急采购，3分钟左右您将得到回复。