参数资料
型号: AD9726BSVZ
厂商: Analog Devices Inc
文件页数: 23/24页
文件大小: 0K
描述: IC DAC 16IT LVDS 400MSPS 80-TQFP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1
系列: TxDAC+®
位数: 16
数据接口: 并联
转换器数目: 1
电压电源: 模拟和数字
功率耗散(最大): 575mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 80-TQFP 裸露焊盘
供应商设备封装: 80-TQFP-EP(12x12)
包装: 托盘
输出数目和类型: 2 电流,单极
采样率(每秒): 400M
产品目录页面: 785 (CN2011-ZH PDF)
配用: AD9726-EBZ-ND - BOARD EVAL FOR AD9726
AD9726
Rev. B | Page 8 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
THERMAL RESISTANCE
Parameter
With Respect to
Rating
DBVDD, AVDD1,
AVDD2
DBGND, AGND1,
AGND2
0.3 V to 3.6 V
DVDD, CLKVDD,
ACVDD, ADVDD
DGND, CLKGND,
ACGND, ADGND
0.3 V to 2.8 V
DBGND, AGND1,
AGND2
DBGND, AGND1,
AGND2
0.3 V to +0.3 V
DGND, CLKGND,
ACGND, ADGND
DGND, CLKGND,
ACGND, ADGND
0.3 V to +0.3 V
REFIO, FSDAJ
AGND1
0.3 V to AVDD1
+ 0.3 V
IOUTA, IOUTB
AGND1
1.0 V to AVDD1
+ 0.3 V
CLK±
CLKGND
0.3 V to CLKVDD
+ 0.3 V
DB[15:0]±,
DCLK_IN±,
DCLK_OUT±
DBGND
0.3 V to DBVDD
+ 0.3 V
CSB, SCLK, SDIO,
SDO, RESET, REXT
DBGND
0.3 V to DBVDD
+ 0.3 V
SDR_EN, SPI_DIS
ADGND
0.3 V to ADVDD
+ 0.3 V
Thermal impedance can be lowered to 23°C/W by soldering the
exposed package pad to an external heat sink (for example, the
internal PCB copper ground plane). However, this is not necessary
for the power dissipation and operating temperature range of
the AD9726.
Table 6. Thermal Resistance
Package Type
θJA
Unit
80-Lead TQFP_EP Package, Thermally Enhanced
32
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
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