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参数资料
| 型号： | ADN2530YCPZ-500R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 14/20页 |
| 文件大小： | 0K |
| 描述： | IC LASER DRVR 11.3GPBS 16LFCSP |
| 标准包装： | 1 |
| 类型： | 激光二极管驱动器（光纤） |
| 数据速率： | 11.3Gbps |
| 通道数： | 1 |
| 电源电压： | 3.07 V ~ 3.53 V |
| 电流 - 电源： | 27mA |
| 电流 - 调制： | 23mA |
| 电流 - 偏置： | 25mA |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 16-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ |
| 包装： | 标准包装 |
| 安装类型： | 表面贴装 |
| 其它名称： | ADN2530YCPZ-500R7DKR |
ADN2530
A compact optical module is a complex thermal environment,
T TOP
Data Sheet
and calculations of device junction temperature using the
package θ JA (junction-to-ambient thermal resistance) do not
yield accurate results. The following equation, derived from the
θ J-TOP
T J
T TOP
model in Figure 38, can be used to estimate the IC junction
temperature:
P
θ J-PAD
T PAD
T J =
P × ( θ J ? PAD × θ J ? TOP ) + T TOP × θ J ? PAD + T PAD × θ J ? TOP
θ J ? PAD + θ J ? TOP
T PAD
Figure 38. Electrical Model for Thermal Calculations
where:
T TOP is the temperature at top of package in degrees Celsius.
T PAD is the temperature at package exposed paddle in degrees
Celsius.
T J is the IC junction temperature in degrees Celsius.
T TOP and T PAD can be determined by measuring the temperature
at points inside the module, as shown in Figure 37. The thermo-
couples should be positioned to obtain an accurate measurement of
the package top and paddle temperatures. θ J-TOP and θ J-PAD are
P is the ADN2530 power dissipation in watts.
θ J-TOP is the thermal resistance from IC junction to package top.
θ J-PAD is the thermal resistance from IC junction to package
exposed pad.
Rev. B | Page 14 of 20
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