参数资料
型号: ADSP-21489BSWZ-3B
厂商: Analog Devices Inc
文件页数: 16/68页
文件大小: 0K
描述: IC CCD SIGNAL PROCESSOR 176LQFP
标准包装: 1
系列: SHARC®
类型: 浮点
接口: EBI/EMI,DAI,I²C,SPI,SPORT,UART/USART
时钟速率: 350MHz
非易失内存: 外部
芯片上RAM: 5Mb
电压 - 输入/输出: 3.30V
电压 - 核心: 1.10V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 176-LQFP 裸露焊盘
供应商设备封装: 176-LQFP-EP(24x24)
包装: 托盘
Rev. B
|
Page 23 of 68
|
March 2013
Note the definitions of the clock periods that are a function of
CLKIN and the appropriate ratio control shown in Table 18. All
of the timing specifications for the ADSP-2148x peripherals are
defined in relation to tPCLK. See the peripheral specific section
for each peripheral’s timing information.
Figure 4 shows core to CLKIN relationships with external oscil-
lator or crystal. The shaded divider/multiplier blocks denote
where clock ratios can be set through hardware or software
using the power management control register (PMCTL). For
more information, see the ADSP-214xx SHARC Processor Hard-
ware Reference.
Power-Up Sequencing
The timing requirements for processor startup are given in
Table 19. While no specific power-up sequencing is required
between VDD_EXT and VDD_INT, there are some considerations
that system designs should take into account.
No power supply should be powered up for an extended
period of time (> 200 ms) before another supply starts to
ramp up.
If the VDD_INT power supply comes up after VDD_EXT, any
pin, such as RESETOUT and RESET, may actually drive
momentarily until the VDD_INT rail has powered up.
Systems sharing these signals on the board must determine
if there are any issues that need to be addressed based on
this behavior.
Note that during power-up, when the VDD_INT power supply
comes up after VDD_EXT, a leakage current of the order of three-
state leakage current pull-up, pull-down may be observed on
any pin, even if that is an input only (for example the RESET
pin) until the VDD_INT rail has powered up.
Table 18. Clock Periods
Timing
Requirements
Description
tCK
CLKIN Clock Period
tCCLK
Processor Core Clock Period
tPCLK
Peripheral Clock Period = 2 × tCCLK
tSDCLK
SDRAM Clock Period = (tCCLK) × SDCKR
Table 19. Power Up Sequencing Timing Requirements (Processor Startup)
Parameter
Min
Max
Unit
Timing Requirements
tRSTVDD
RESET Low Before VDD_EXT or VDD_INT On
0
ms
tIVDDEVDD
VDD_INT On Before VDD_EXT
–200
+200
ms
tCLKVDD
1
CLKIN Valid After VDD_INT and VDD_EXT Valid
0
200
ms
tCLKRST
CLKIN Valid Before RESET Deasserted
102
μs
tPLLRST
PLL Control Setup Before RESET Deasserted
203
μs
Switching Characteristic
tCORERST
4, 5
Core Reset Deasserted After RESET Deasserted
4096 × tCK + 2 × tCCLK
1 Valid VDD_INT and VDD_EXT assumes that the supplies are fully ramped to their nominal values (it does not matter which supply comes up first). Voltage ramp rates can vary
from microseconds to hundreds of milliseconds depending on the design of the power supply subsystem.
2 Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's data sheet for startup time. Assume
a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3 Based on CLKIN cycles.
4 Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
5 The 4096 cycle count depends on tSRST specification in Table 21. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in 4097
cycles maximum.
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