参数资料
型号: ADSP-21489BSWZ-3B
厂商: Analog Devices Inc
文件页数: 27/68页
文件大小: 0K
描述: IC CCD SIGNAL PROCESSOR 176LQFP
标准包装: 1
系列: SHARC®
类型: 浮点
接口: EBI/EMI,DAI,I²C,SPI,SPORT,UART/USART
时钟速率: 350MHz
非易失内存: 外部
芯片上RAM: 5Mb
电压 - 输入/输出: 3.30V
电压 - 核心: 1.10V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 176-LQFP 裸露焊盘
供应商设备封装: 176-LQFP-EP(24x24)
包装: 托盘
Rev. B
|
Page 33 of 68
|
March 2013
AMI Read
Use these specifications for asynchronous interfacing to memo-
ries. Note that timing for AMI_ACK, ADDR, DATA, AMI_RD,
AMI_WR, and strobe timing parameters only apply to asyn-
chronous access mode.
Table 32. AMI Read
Parameter
Min
Max
Unit
Timing Requirements
tDAD
1, 2, 3
Address Selects Delay to Data Valid
W + tSDCLK –5.4
ns
tDRLD
AMI_RD Low to Data Valid
W – 3.2
ns
tSDS
Data Setup to AMI_RD High
2.5
ns
tHDRH
4, 5
Data Hold from AMI_RD High
0
ns
tDAAK
AMI_ACK Delay from Address, Selects
tSDCLK –9.5 + W
ns
tDSAK
4
AMI_ACK Delay from AMI_RD Low
W – 7
ns
Switching Characteristics
tDRHA
Address Selects Hold After AMI_RD High
RHC + 0.20
ns
tDARL
Address Selects to AMI_RD Low
tSDCLK – 3.8
ns
tRW
AMI_RD Pulse Width
W – 1.4
ns
tRWR
AMI_RD High to AMI_RD Low
HI + tSDCLK – 1
ns
W = (number of wait states specified in AMICTLx register) × tSDCLK.
RHC = (number of Read Hold Cycles specified in AMICTLx register) × tSDCLK
Where PREDIS = 0
HI = RHC: Read to Read from same bank
HI = RHC + IC: Read to Read from different bank
HI = RHC + Max (IC, (4 × tSDCLK)): Read to Write from same or different bank
Where PREDIS = 1
HI = RHC + Max (IC, (4 × tSDCLK)): Read to Write from same or different bank
HI = RHC + (3 × tSDCLK): Read to Read from same bank
HI = RHC + Max (IC, (3 × tSDCLK): Read to Read from different bank
IC = (number of idle cycles specified in AMICTLx register) × tSDCLK
H = (number of hold cycles specified in AMICTLx register) × tSDCLK
1 Data delay/setup: System must meet tDAD, tDRLD, or tSDS.
2 The falling edge of MSx, is referenced.
3 The maximum limit of timing requirement values for tDAD and tDRLD parameters are applicable for the case where AMI_ACK is always high and when the ACK feature is not
used.
4 Note that timing for AMI_ACK, ADDR, DATA, AMI_RD, AMI_WR, and strobe timing parameters only apply to asynchronous access mode.
5 Data hold: User must meet tHDRH in asynchronous access mode. See Test Conditions on Page 55 for the calculation of hold times given capacitive and dc loads.
6 AMI_ACK delay/setup: User must meet tDAAK, or tDSAK, for deassertion of AMI_ACK (low).
相关PDF资料
PDF描述
ADSP-2171BSTZ-133 IC DSP CONTROLLER 16BIT 128TQFP
ADSP-2181KSZ-160 IC DSP CONTROLLER 16BIT 128-PQFP
ADSP-2183KCA-210 IC DSP CONTROLLER 16BIT 144MBGA
ADSP-2184BSTZ-160 IC DSP CONTROLLER 16BIT 100LQFP
ADSP-2185BSTZ-133 IC DSP CONTROLLER 16BIT 100TQFP
相关代理商/技术参数
参数描述
ADSP-21489BSWZ-4A 功能描述:IC CCD SIGNAL PROCESSOR 100LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C,McASP,McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA,FCBGA 供应商设备封装:548-FCBGA(27x27) 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
ADSP-21489BSWZ-4B 功能描述:IC CCD SIGNAL PROCESSOR 176LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:40 系列:TMS320DM64x, DaVinci™ 类型:定点 接口:I²C,McASP,McBSP 时钟速率:400MHz 非易失内存:外部 芯片上RAM:160kB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:0°C ~ 90°C 安装类型:表面贴装 封装/外壳:548-BBGA,FCBGA 供应商设备封装:548-FCBGA(27x27) 包装:托盘 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
ADSP-21489BSWZ-AX 制造商:Analog Devices 功能描述:X GRADE SHARC PROCESSOR - Trays
ADSP-21489BSWZ-BX 制造商:Analog Devices 功能描述:X GRADE SHARC PROCESSOR - Trays
ADSP-21489KSWZ-3A 功能描述:IC CCD SIGNAL PROCESSOR 100LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP(数字式信号处理器) 系列:SHARC® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI,以太网,RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA,FCBGA 供应商设备封装:431-FCPBGA(20x20) 包装:托盘