参数资料
型号: AG003-01E
厂商: NVE Corp/Sensor Products
文件页数: 62/145页
文件大小: 0K
描述: ASSEMBLY CURRENT SENSOR EVAL
标准包装: 1
传感器类型: 磁性 GMR(大型磁阻传感)
接口: 模拟
嵌入式:
已供物品: 板,CD
已用 IC / 零件: AA 系列电流传感器
产品目录页面: 2839 (CN2011-ZH PDF)
相关产品: 391-1054-5-ND - SENSORS MAGNETIC FIELD LP 8-SOIC
391-1052-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1050-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1049-5-ND - SENSORS MAGNETIC FIELD 8MSOP
391-1048-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1045-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1032-5-ND - SENSORS MAGNETIC FIELD 8MSOP
391-1030-5-ND - SENSORS MAGNETIC FIELD 8MSOP
AB001-02-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1020-5-ND - SENSORS MAGNETIC FIELD LP 8-SOIC
更多...
其它名称: 391-1060
Peripheral Integrated Circuits
DB001-00 Series Power Switch IC
Features:
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Designed to Work with AD9xx
High Current Output
Short Circuit, Reverse Battery, and Transient Protection
LED Driver
Excellent Temperature and Voltage Performance
Small, Low-Profile Surface Mount Package
Applications:
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Output Driver for Sensor Assemblies
Usable with Magnetic, Inductive, and Photo Sensors
Description:
The DB001-00 signal processing IC is designed to take the digital input signal from NVE’s AD9xx
GMR Switch and provide a high current switched output corresponding with the sensor input. The part
functions as the “front end” of a complete sensor assembly and includes protection against short
circuits and high voltage transients from capacitive and inductive loads. The parts also feature thermal
shutdown circuitry and reverse battery protection. It provides a regulated output voltage for the sensor
and other components in the assembly and an LED driver to indicate an “ON” condition.
Together, the AD9xx GMR Switch and the DB001-00 signal processing IC form the bulk of the signal
processing required for pneumatic cylinder position sensing electronics. Using these two ICs, the end
user only requires a few capacitors and an LED in order to implement the complete sensor assembly
circuit. In addition, both the AD9xx part and the DB001-00 part come in MSOP8 packages, so that the
customer can implement the complete design on an extremely small PCB.
If ultra-miniaturization is desired, the DB001 part can be obtained in die form for COB (Chip On
Board) or flip-chip assembly.
Part Numbers and Configurations:
Part
Number
DB001-00
DB001-01
Input
Current Sinking from
AD9xx-00
Current Sinking from
AD9xx-00
Die Size (mm)
1.48 x 2.25
1.48 x 2.25
Package
MSOP8
Raw IC
Marking
FFD
30284D
- 62 -
www.nve.com phone: 952-829-9217 fax: 952-829-9189
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