参数资料
型号: AG003-01E
厂商: NVE Corp/Sensor Products
文件页数: 69/145页
文件大小: 0K
描述: ASSEMBLY CURRENT SENSOR EVAL
标准包装: 1
传感器类型: 磁性 GMR(大型磁阻传感)
接口: 模拟
嵌入式:
已供物品: 板,CD
已用 IC / 零件: AA 系列电流传感器
产品目录页面: 2839 (CN2011-ZH PDF)
相关产品: 391-1054-5-ND - SENSORS MAGNETIC FIELD LP 8-SOIC
391-1052-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1050-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1049-5-ND - SENSORS MAGNETIC FIELD 8MSOP
391-1048-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1045-5-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1032-5-ND - SENSORS MAGNETIC FIELD 8MSOP
391-1030-5-ND - SENSORS MAGNETIC FIELD 8MSOP
AB001-02-ND - SENSORS MAGNETIC FIELD 8SOIC
391-1020-5-ND - SENSORS MAGNETIC FIELD LP 8-SOIC
更多...
其它名称: 391-1060
Peripheral Integrated Circuits
Notes:
1.
2.
Power dissipation rating for TDFN6 package in free air is 320°C/Watt. Soldering the package to a PCB, including the die
attach paddle, improves temperature performance substantially. The input voltage and output current are limited by thermal
power dissipation at the package.
Due to package size, TDFN6 package has a three-letter code to designate part type.
Package:
Please see the package drawing section in the Appendix for dimensions of the TDFN6 package.
Pin Configuration
Vreg (Out)
No Connect
No Connect
VCC (In)
DC001-10,
DC002-10
Ground
No Connect
Note: The die attach pad is exposed on the back of this package. NVE recommends that it be connected to
the ground pin and the PCB for improved temperature performance.
- 69 -
www.nve.com phone: 952-829-9217 fax: 952-829-9189
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