参数资料
型号: AGLE600V2-FGG256
厂商: Microsemi SoC
文件页数: 144/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
标准包装: 90
系列: IGLOOe
逻辑元件/单元数: 13824
RAM 位总计: 110592
输入/输出数: 165
门数: 600000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
IGLOOe Low Power Flash FPGAs
Revision 13
2-65
Timing Characteristics
1.5 V DC Core Voltage
1.2 V DC Core Voltage
Table 2-117 Minimum and Maximum DC Input and Output Levels
DC Parameter
Description
Min.
Max.
Min.
Max.
Min.
Max.
Units
VCCI
Supply Voltage
3.0
3.3
3.6
V
VOL
Output Low Voltage
0.96
1.27
1.06
1.43
1.30
1.57
V
VOH
Output High Voltage
1.8
2.11
1.92
2.28
2.13
2.41
V
VIL, VIH
Input Low, Input High Voltages
0
3.6
0
3.6
0
3.6
V
VODIFF
Differential Output Voltage
0.625
0.97
0.625
0.97
0.625
0.97
V
VOCM
Output Common Mode Voltage
1.762
1.98
1.762
1.98
1.762
1.98
V
VICM
Input Common Mode Voltage
1.01
2.57
1.01
2.57
1.01
2.57
V
VIDIFF
Input Differential Voltage
300
mV
Table 2-118 AC Waveforms, Measuring Points, and Capacitive Loads
Input LOW (V)
Input HIGH (V)
Measuring Point* (V)
VREF (typ.) (V)
1.64
1.94
Cross point
Note: *Measuring point = Vtrip. See Table 2-23 on page 2-23 for a complete table of trip points.
Table 2-119 LVPECL – Applies to 1.5 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Speed Grade
tDOUT
tDP
tDIN
tPY
Units
Std.
0.98
1.75
0.19
1.45
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-120 LVPECL – Applies to 1.2 V DC Core Voltage
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.14 V, Worst-Case VCCI = 3.0 V
Speed Grade
tDOUT
tDP
tDIN
tPY
Units
Std.
1.55
2.16
0.26
1.70
ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-6 for derating values.
相关PDF资料
PDF描述
RMA50DTKI-S288 CONN EDGECARD 100POS .125 EXTEND
RMM36DTAN CONN EDGECARD 72POS R/A .156 SLD
RMM36DTAH CONN EDGECARD 72POS R/A .156 SLD
M1A3P1000-FG144I IC FPGA M1 1KB FLASH 1M 144FPGA
M1A3P1000-FGG144I IC FPGA M1 1KB FLASH 1M 144FPGA
相关代理商/技术参数
参数描述
AGLE600V2-FGG256I 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
AGLE600V2-FGG484 功能描述:IC FPGA IGLOOE 1.2-1.5V 484FPBG RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
AGLE600V2-FGG484I 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
AGLE600V2-FGG896 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology