参数资料
型号: AGLE600V2-FGG256
厂商: Microsemi SoC
文件页数: 158/166页
文件大小: 0K
描述: IC FPGA 1KB FLASH 600K 256-FBGA
标准包装: 90
系列: IGLOOe
逻辑元件/单元数: 13824
RAM 位总计: 110592
输入/输出数: 165
门数: 600000
电源电压: 1.14 V ~ 1.575 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
IGLOOe Low Power Flash FPGAs
Revision 13
2-77
Timing Characteristics
1.5 V DC Core Voltage
Figure 2-32 Input DDR Timing Diagram
tDDRICLR2Q2
tDDRIREMCLR
tDDRIRECCLR
tDDRICLR2Q1
12
3
4
5
6
7
8
9
CLK
Data
CLR
Out_QR
Out_QF
tDDRICLKQ1
2
4
6
3
5
7
tDDRIHD
tDDRISUD
tDDRICLKQ2
Table 2-130 Input DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter
Description
Std.
Units
tDDRICLKQ1
Clock-to-Out Out_QR for Input DDR
0.48
ns
tDDRICLKQ2
Clock-to-Out Out_QF for Input DDR
0.65
ns
tDDRISUD1
Data Setup for Input DDR (negedge)
0.50
ns
tDDRISUD2
Data Setup for Input DDR (posedge)
0.40
ns
tDDRIHD1
Data Hold for Input DDR (negedge)
0.00
ns
tDDRIHD2
Data Hold for Input DDR (posedge)
0.00
ns
tDDRICLR2Q1
Asynchronous Clear to Out Out_QR for Input DDR
0.82
ns
tDDRICLR2Q2
Asynchronous Clear-to-Out Out_QF for Input DDR
0.98
ns
tDDRIREMCLR
Asynchronous Clear Removal Time for Input DDR
0.00
ns
tDDRIRECCLR
Asynchronous Clear Recovery Time for Input DDR
0.23
ns
tDDRIWCLR
Asynchronous Clear Minimum Pulse Width for Input DDR
0.19
ns
tDDRICKMPWH
Clock Minimum Pulse Width HIGH for Input DDR
0.31
ns
tDDRICKMPWL
Clock Minimum Pulse Width LOW for Input DDR
0.28
ns
FDDRIMAX
Maximum Frequency for Input DDR
250.00
MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
相关PDF资料
PDF描述
RMA50DTKI-S288 CONN EDGECARD 100POS .125 EXTEND
RMM36DTAN CONN EDGECARD 72POS R/A .156 SLD
RMM36DTAH CONN EDGECARD 72POS R/A .156 SLD
M1A3P1000-FG144I IC FPGA M1 1KB FLASH 1M 144FPGA
M1A3P1000-FGG144I IC FPGA M1 1KB FLASH 1M 144FPGA
相关代理商/技术参数
参数描述
AGLE600V2-FGG256I 功能描述:IC FPGA 1KB FLASH 600K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
AGLE600V2-FGG484 功能描述:IC FPGA IGLOOE 1.2-1.5V 484FPBG RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA(23x23) 其它名称:220-1241
AGLE600V2-FGG484I 功能描述:IC FPGA 1KB FLASH 600K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:IGLOOe 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)
AGLE600V2-FGG896 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology
AGLE600V2-FGG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology