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| 型号： | AMIS30621C6217G |
| 厂商： | ON Semiconductor |
| 文件页数： | 5/59页 |
| 文件大小： | 0K |
| 描述： | IC MOTOR STEPPER DVR/CTLR 20SOIC |
| 标准包装： | 38 |
| 应用： | PWM 电机驱动器，步进电机驱动器 |
| 评估套件： | 可供 |
| 输出数： | 1 |
| 电流 - 输出： | 800mA |
| 电压 - 负载： | 6.5 V ~ 29 V |
| 电源电压： | 6.5 V ~ 29 V |
| 工作温度： | -40°C ~ 165°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 20-SOIC |
| 包装： | 管件 |
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AMIS ? 30621
PACKAGE THERMAL RESISTANCE
The AMIS ? 30621 is available in SOIC ? 20 and optimized
NQFP32 packages. For cooling optimizations, the NQFP
has an exposed thermal pad which has to be soldered to the
PCB ground plane. The ground plane needs thermal vias to
conduct the head to the bottom layer. Figures 3 and 4 give
examples for good power distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the devices are given. The thermal
media to which the power of the devices has to be given are:
? Static environmental air (via the case)
? PCB board copper area (via the device pins and
exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters.
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rthja) and the overall Rth
from the junction to the leads (Rthjp).
The NQFP device is designed to provide superior thermal
performance. Using an exposed die pad on the bottom
surface of the package, is mainly contributing to this
performance. In order to take full advantage of the exposed
pad, it is most important that the PCB has features to conduct
heat away from the package. A thermal grounded pad with
thermal vias can achieve this.
In below table, one can find the values for the Rthja and
Rthjp, simulated according to the JESD ? 51standard:
Rth
Junction ? to ? Leads and
Rth
Junction ? to ? Leads
Rth
Junction ? to ? Ambient
Rth
Junction ? to ? Ambient
Package
Exposed Pad (Rthjp)
(Rthjp)
Rthja 1S0P
Rthja 2S2P
SOIC ? 20
NQFP ? 32
0.95
19
62
60
39
30
The Rthja for 2S2P is simulated conform to JESD ? 51 as
follows:
? A 4 ? layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
? Board thickness is 1.46 mm (FR4 PCB material)
? The 2 signal layers: 70 m m thick copper with an area of
5500 mm 2 copper and 20% conductivity
? The 2 power internal planes: 36 m m thick copper with
an area of 5500 mm 2 copper and 90% conductivity
Figure 3. Example of SOIC ? 20 PCB Ground Plane
Layout (Preferred Layout at Top and Bottom)
The Rthja for 1S0P is simulated conform to JESD ? 51 as
follows:
? A 1 ? layer printed circuit board with only 1 layer
? Board thickness is 1.46 mm (FR4 PCB material)
? The layer has a thickness of 70 m m copper with an area
of 5500 mm 2 copper and 20% conductivity
NQFP ? 32
Figure 4. Example of NQFP ? 32 PCB Ground Plane
Layout (Preferred Layout at Top and Bottom)
http://onsemi.com
5
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AMIS30621C6217RG | 功能描述:马达/运动/点火控制器和驱动器 LIN STEPPER DRIVER RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube |
| AMIS-30622 | 制造商:AMI 制造商全称:AMI 功能描述:I2C Microstepping Motordriver |
| AMIS-30622AGA | 制造商:ON Semiconductor 功能描述:MICROSTEPPING MOTOR CNTRLR - Rail/Tube 制造商:ON Semiconductor 功能描述:MICROSTEPPING MOTOR CNTRLR - Tape and Reel |
| AMIS-30622ANA | 制造商:ON Semiconductor 功能描述:MICROSTEPPING MOTOR CNTRLR - Trays 制造商:ON Semiconductor 功能描述:MICROSTEPPING MOTOR CNTRLR - Tape and Reel |
| AMIS30622C6223G | 功能描述:马达/运动/点火控制器和驱动器 I2C STEPPER DRIVER RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube |
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