参数资料
型号: APA150-FGG256
厂商: Microsemi SoC
文件页数: 127/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 150K 256-FBGA
标准包装: 90
系列: ProASICPLUS
RAM 位总计: 36864
输入/输出数: 186
门数: 150000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
ProASICPLUS Flash Family FPGAs
2- 42
v5.9
Tristate Buffer Delays
Figure 2-23 Tristate Buffer Delays
Table 2-27 Worst-Case Commercial Conditions
VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C
Macro Type
Description
Max.
tDLH
1
Max.
tDHL
2
Max.
tENZH
3
Max.
tENZL
4
Units
Std.
OTB33PH
3.3 V, PCI Output Current, High Slew Rate
2.0
2.2
2.0
ns
OTB33PN
3.3 V, High Output Current, Nominal Slew Rate
2.2
2.9
2.4
2.1
ns
OTB33PL
3.3 V, High Output Current, Low Slew Rate
2.5
3.2
2.7
2.8
ns
OTB33LH
3.3 V, Low Output Current, High Slew Rate
2.6
4.0
2.8
3.0
ns
OTB33LN
3.3 V, Low Output Current, Nominal Slew Rate
2.9
4.3
3.2
4.1
ns
OTB33LL
3.3 V, Low Output Current, Low Slew Rate
3.0
5.6
3.3
5.5
ns
Notes:
1. tDLH = Data-to-Pad High
2. tDHL = Data-to-Pad Low
3. tENZH = Enable-to-Pad, Z to High
4. tENZL = Enable-to-Pad, Z to Low
Table 2-28 Worst-Case Commercial Conditions
VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C
Macro Type
Description
Max.
tDLH
1
Max.
tDHL
2
Max.
tENZH
3
Max.
tENZL
4
Units
Std.
OTB25LPHH
2.5 V, Low Power, High Output Current, High Slew Rate5
2.0
2.1
2.3
2.0
ns
OTB25LPHN
2.5 V, Low Power, High Output Current, Nominal Slew Rate5
2.4
3.0
2.7
2.1
ns
OTB25LPHL
2.5 V, Low Power, High Output Current, Low Slew Rate5
2.9
3.2
3.1
2.7
ns
OTB25LPLH
2.5 V, Low Power, Low Output Current, High Slew Rate5
2.7
4.6
3.0
2.6
ns
OTB25LPLN
2.5 V, Low Power, Low Output Current, Nominal Slew Rate5
3.5
4.2
3.8
ns
OTB25LPLL
2.5 V, Low Power, Low Output Current, Low Slew Rate5
4.0
5.3
4.2
5.1
ns
Notes:
1. tDLH = Data-to-Pad High
2. tDHL = Data-to-Pad Low
3. tENZH = Enable-to-Pad, Z to High
4. tENZL = Enable-to-Pad, Z to Low
5. Low power I/O work with VDDP = 2.5 V ±10% only. VDDP = 2.3 V for delays.
PAD
A
OTBx
A
50%
PAD
VOL
VOH
50%
t
DLH
50%
t
DHL
EN
50%
PAD
VOL
50%
t
ENZL
50%
10%
EN
50%
PAD
GND
V
OH
50%
t
ENZH
50%
90%
VDDP
35 pF
EN
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