参数资料
型号: APA150-FGG256
厂商: Microsemi SoC
文件页数: 90/178页
文件大小: 0K
描述: IC FPGA PROASIC+ 150K 256-FBGA
标准包装: 90
系列: ProASICPLUS
RAM 位总计: 36864
输入/输出数: 186
门数: 150000
电源电压: 2.3 V ~ 2.7 V
安装类型: 表面贴装
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FPBGA(17x17)
ProASICPLUS Flash Family FPGAs
v5.9
2-9
The TAP controller receives two control inputs (TMS and
TCK) and generates control and clock signals for the rest
of the test logic architecture. On power-up, the TAP
controller enters the Test-Logic-Reset state. To guarantee
a reset of the controller from any of the possible states,
TMS must remain high for five TCK cycles. The TRST pin
may also be used to asynchronously place the TAP
controller in the Test-Logic-Reset state.
ProASICPLUS devices support three types of test data
registers: bypass, device identification, and boundary
scan. The bypass register is selected when no other
register needs to be accessed in a device. This speeds up
test data transfer to other devices in a test data path.
The 32-bit device identification register is a shift register
with four fields (lowest significant byte (LSB), ID number,
part number and version). The boundary-scan register
observes and controls the state of each I/O pin.
Each I/O cell has three boundary-scan register cells, each
with a serial-in, serial-out, parallel-in, and parallel-out
pin. The serial pins are used to serially connect all the
boundary-scan register cells in a device into a boundary-
scan register chain, which starts at the TDI pin and ends
at the TDO pin. The parallel ports are connected to the
internal core logic tile and the input, output, and control
ports of an I/O buffer to capture and load data into the
register to control or observe the logic state of each I/O.
Figure 2-10 TAP Controller State Diagram
Test-Logic
Reset
Run-Test/
Idle
Select-DR-
Scan
Capture-DR
Shift-DR
Exit-DR
Pause-DR
Exit2-DR
Update-DR
Select-IR-
Scan
Capture-IR
Shift-IR
Exit-IR
Pause-IR
Exit2-IR
Update-IR
1
0
1
0
00
1
00
1
0
1
0
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APA150-FGG256A 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:90 系列:ProASIC3 LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:36864 输入/输出数:157 门数:250000 电源电压:1.425 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 125°C 封装/外壳:256-LBGA 供应商设备封装:256-FPBGA(17x17)
APA150-FGG256I 功能描述:IC FPGA PROASIC+ 150K 256-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:ProASICPLUS 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
APA150-FGGB 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA150-FGGES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs
APA150-FGGI 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC Flash Family FPGAs