参数资料
型号: AS3517-T
厂商: ams
文件页数: 4/94页
文件大小: 0K
描述: IC CODEC AFE AUDIO STER 81-CTBGA
标准包装: 2,000
类型: 音频编解码器
应用: 便携式音频,电话
安装类型: 表面贴装
封装/外壳: 81-TFBGA
供应商设备封装: 81-CTBGA(9x9)
包装: 带卷 (TR)
AS3517 V17
Data Sheet, Confidential
2003-2007, austriamicrosystems AG, 8141 Unterpremstaetten, Austria-Europe. All Rights Reserved.
www.austriamicrosystems.com
8 Absolute Maximum Ratings (Non-Operating)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings
only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device should be
operated under recommended operating conditions.
Table 3
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Note
VIN_5V
5V pins
-0.5
7.0
V
Applicable for pins BVDD, BVDDH,
BVDDC1, BVDDC2, BVDDC3, BVDDR,
CHG_IN, VBUS
VIN_SW15
15V pin
-0.5
17
V
Applicable for pin SW15
VIN_VSS
Voltage difference at VSS
terminals
-0.5
0.5
V
Applicable for pins CVSS3, CVSS15,
CVSS1, CVSS2, VSSH, AVSS, DVSS
VIN_DVDD
3.3V pins with diode to DVDD
-0.5
5.0
DVDD+0.5
V
Applicable for pins LRCK, SCLK, SDI,
VPRG1, VPRG2, BATTEMP, ISINK,
XIN32, XOUT32, XIN24, XOUT24, XIRQ,
XRES, PWGD, Q32K, Q24M, HBT
VIN_xDVDD
pins with no diode to DVDD
-0.5
7.0V
V
Applicable for pins
CSCL, CSDA, PWRUP
VIN_AVDD
3.3V pins with diode to AVDD
-0.5
5.0
AVDD+0.5
V
Applicable for pins HPCM, HPGND,
LOUT1L/R, LOUT2L/R, VREF, AGND,
LIN1L/R, LIN2L/R, MIC1P/N, MIC2P/N,
MIC1S, MIC2S
VIN_REG
voltage regulator pins with
diodes to BVDD
-0.5
5.0
BVDD+0.5
V
Applicable for pins AVDD, DVDD,
PVDD1/2, CVDD1/2/3, UVDD
VIN_RVDD
voltage regulator pin with
diode to BVDD
-0.5
3.6
BVDD+0.5
V
Applicable for pins RVDD
VIN_BVDD
pins with diode to BVDD
-0.5
7.0
BVDD+0.5
V
Applicable for pins HPR/L, CHG_OUT
Iscr
Input Current (latchup
immunity)
-100
100
mA
Norm: JEDEC 17
ESD
Electrostatic Discharge HBM
+/-1
kV
Norm: JEDEC JESD22-A114C
Pt
Total Power Dissipation (all
supplies and outputs)
1000
mW
BGA81, Tamb=70°C
H
Humidity non-condensing
5
85
%
Table 4
Soldering Conditions
Symbol
Parameter
Min
Max
Unit
Note
Tbody
Package Body Temperature
260
°C
Norm IPC/JEDEC J-STD-020C, reflects
moisture sensitivity level only
Tpeak
235
245
°C
Dwell
Solder Profile*
30
45
s
above 217 °C
* austriamicrosystems AG strongly recommends to use underfill.
Revision 1v3
11
- 93
ams
AG
Technical
content
still
valid
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