参数资料
型号: AUIRFR4105ZTR
厂商: International Rectifier
文件页数: 1/14页
文件大小: 0K
描述: MOSFET N-CH 55V 30A DPAK
标准包装: 2,000
系列: HEXFET®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 30A
开态Rds(最大)@ Id, Vgs @ 25° C: 24.5 毫欧 @ 18A,10V
Id 时的 Vgs(th)(最大): 4V @ 250µA
闸电荷(Qg) @ Vgs: 27nC @ 10V
输入电容 (Ciss) @ Vds: 740pF @ 25V
功率 - 最大: 48W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: D-Pak
包装: 带卷 (TR)
PD - 97544
AUTOMOTIVE GRADE
AUIRFR4105Z
AUIRFU4105Z
HEXFET ? Power MOSFET
Features
● Advanced Process Technology
● Ultra Low On-Resistance
● 175°C Operating Temperature
● Fast Switching
● Repetitive Avalanche Allowed up to Tjmax
● Lead-Free, RoHS Compliant
G
D
S
V (BR)DSS
R DS(on) max.
I D
55V
24.5m ?
30A
Automotive Qualified *
Description
Specifically designed for Automotive applications,
this HEXFET ? Power MOSFET utilizes the latest
D
G
processing techniques to achieve extremely low on-
resistance per silicon area. Additional features of this
design are a 175°C junction operating temperature,
fast switching speed and improved repetitive ava-
lanche rating . These features combine to make this
S
G
D-Pak
AUIRFR4105Z
S
D
I-Pak
AUIRFU4105Z
design an extremely efficient and reliable device for
use in Automotive applications and a wide variety of
other applications.
G
Gate
D
Drain
S
Source
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.
Ambient temperature (T A ) is 25°C, unless otherwise specified.
Parameter
Max.
Units
I D @ T C = 25°C
Continuous Drain Current, V GS @ 10V
30
I D @ T C = 100°C
I DM
P D @T C = 25°C
V GS
E AS
E AS (tested )
I AR
Continuous Drain Current, V GS @ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
21
120
48
0.32
± 20
29
46
See Fig.12a, 12b, 15, 16
A
W
W/°C
V
mJ
A
E AR
T J
T STG
Repetitive Avalanche Energy
Operating Junction and
Storage Temperature Range
-55 to + 175
mJ
°C
Soldering Temperature, for 10 seconds (1.6mm from case )
Mounting Torque, 6-32 or M3 screw
Thermal Resistance
300
10 lbf in (1.1N m)
Parameter
Typ.
Max.
Units
R θ JC
Junction-to-Case
–––
3.12
R θ JA
R θ JA
Junction-to-Ambient (PCB mount)
Junction-to-Ambient
–––
–––
50
110
°C/W
HEXFET ? is a registered trademark of International Rectifier.
* Qualification standards can be found at http://www.irf.com/
www.irf.com
1
07/23/2010
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