参数资料
| 型号： | BD3508EKN-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 13/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ 20HQFN |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 可调 |
| 输入电压： | 1.2 V ~ 6.5 V |
| 电压 - 压降（标准）： | 0.065V @ 1A |
| 稳压器数量： | 1 |
| 电流 - 限制（最小）： | 3A |
| 工作温度： | -10°C ~ 100°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-VQFN |
| 供应商设备封装： | 20-HQFN |
| 包装： | 带卷 (TR) |
● Operation Notes
1.
Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
3. Output pin
In the event that load containing a large inductance component is connected to the output terminal, and generation of
back-EMF at the start-up and when output is turned OFF is assumed, it is requested to insert a protection diode.
(Example)
OUTPUT PIN
4. GND voltage
The potential of GND pin must be minimum potential in all operating conditions.
5. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8. ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
9. Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed
only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is
assumed.
TSD on temperature [°C] (typ.) Hysteresis temperature [°C] (typ.)
BD3508EKN 175
15
10. Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BD3508MUV | 制造商:ROHM 制造商全称:Rohm 功能描述:Nch FET Ultra LDO for PC Chipsets |
| BD3508MUV_09 | 制造商:ROHM 制造商全称:Rohm 功能描述:Ultra Low Dropout Linear Regulators for PC Chipsets |
| BD3508MUV-E2 | 功能描述:低压差稳压器 - LDO ULTRA LOW DROPOUT LIN. REG. RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| BD3509MUV | 制造商:ROHM 制造商全称:Rohm 功能描述:Nch FET Ultra LDO for PC Chipsets |
| BD3509MUV_10 | 制造商:ROHM 制造商全称:Rohm 功能描述:Nch FET Ultra LDO for PC Chipsets |
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