参数资料
| 型号： | BR34L02FVT-WE2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 16/18页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM I2C SPD 2KB 8-TSSOP |
| 标准包装： | 1 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 2K (256 x 8) |
| 速度： | 400kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 1.7 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 8-TSSOP-B |
| 包装： | 标准包装 |
| 其它名称： | BR34L02FVT-WE2DKR |
BR34L02FV-W
Technical Note
● Notes for Use
1) Descrived numeric values and data are design representative values, and the values are not guaranteed.
2)
3)
4)
5)
6)
7)
We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics
further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with
sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external
parts and our LSI.
Absolute maximum ratings
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded,
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case
of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it
that conditions exceeding the absolute maximum ratings should not be impressed to LSI.
GND electric potential
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that
of GND terminal.
Heat design
In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin.
Terminal to terminal short circuit and wrong packaging
When to package LSI on to a board, pay sufficient attention to LSI direction and displacement. Wrong packaging
may destruct LSI. And in the case of short circuit between LSI terminals and terminals and power source,
terminal and GND owing to foreign matter, LSI may be destructed.
Use in a strong electromagnetic field may cause malfunction, therfore, evaluate design sufficiently
.
www.rohm.com
? 2009 ROHM Co., Ltd. All rights reserved.
16/17
2009.04 - Rev.A
相关PDF资料 |
PDF描述 |
|---|---|
| AGL125V5-FG144 | IC FPGA 1KB FLASH 125K 144FBGA |
| A3P060-CS121I | IC FPGA 1KB FLASH 60K 121-CSP |
| BR24T64F-WE2 | IC EEPROM I2C 64K 400KHZ 8-SOP |
| A3P060-CSG121I | IC FPGA 1KB FLASH 60K 121-CSP |
| AGL030V2-CSG81I | IC FPGA 1KB FLASH 30K 81-CSP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BR34L02FVT-WSE2 | 制造商:ROHM Semiconductor 功能描述:IC EEPROM |
| BR34L02FV-W | 制造商:ROHM 制造商全称:Rohm 功能描述:DDR1/DDR2 For memory module) SPD Memory |
| BR34L02FV-W_09 | 制造商:ROHM 制造商全称:Rohm 功能描述:DDR1/DDR2 For memory module) SPD Memory |
| BR34L02FV-WE2 | 功能描述:电可擦除可编程只读存储器 SRL 256X8 BIT RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8 |
| BR34L02-W | 制造商:ROHM 制造商全称:Rohm 功能描述:2Kbit Serial I2C BUS EEPROM For SPD DRAM Memory Module |
发布紧急采购，3分钟左右您将得到回复。