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参数资料
| 型号： | BU-61840B3-100L |
| 厂商： | DATA DEVICE CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128 |
| 封装： | 0.815 X 0.815 INCH, 0.140 INCH HEIGHT, BGA-128 |
| 文件页数： | 37/60页 |
| 文件大小： | 763K |
| 代理商： | BU-61840B3-100L |
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42
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
D-03/02-250
THERMAL AND MECHANICAL MANAGEMENT FOR
BGA PACKAGE OPTION
Ball Grid Array (BGA) components necessitate that thermal
management issues be considered early in the design stage for
MIL-STD-1553 terminals. This is especially true if high transmit-
ter duty cycles are expected. The temperature range specified for
DDC's BGA devices refers to the temperature at the ball, not the
case.
All Enhanced Mini-ACE BGA packaged devices incorporate six
package connections (E2, F2, G2, U13, U14, and U15), which
perform the dual function of circuit ground and thermal heat sink.
It is mandatory that these six balls be directly soldered to a cir-
cuit ground plane (a circuit trace is insufficient). Operation with-
out an adequate ground/thermal plane is not recommended and
extended exposure to these conditions may affect device relia-
bility.
The purpose of this ground/thermal plane is to conduct the heat
being generated by the transceivers within the package and con-
duct this heat away from the BGA. In general, the circuit ground
Thermal Balls
(Two groups: E2, F2, G2;
and U13, U14, U15)
PC Board
Enhanced Mini-ACE
BGA Package
Thermal Plane
Signal Ground
Plane
Thermal Vias
Underfill
Prepreg,
Approx. 0.003" thick
Top (component)
Layer
Signal Layer
0.022"
dia.
0.0394"
Pitch
Detail A
and thermal (chassis) ground are not the same ground plane. It
is acceptable for these six balls to be directly soldered to a
ground plane but it must be located in close physical and thermal
proximity ("0.003" pre-preg layer recommended) to the thermal
plane (See FIGURE 16).
Additionally, "Underfill" must be used in order to ensure the long-
term reliability of the BGA's attachment to the board. Underfill is
used with BGAs in order to reinforce the solder bonds to the
user's circuit board. The underfill modulates the TCE differences
between materials. The industry has shown that underfills are
necessary with BGA devices in order to ensure long-term relia-
bility when exposed to both thermal and mechanical shock.
DDC has successfully utilized Emerson and Cumming, Amicon
E-1172 as underfill. The E-1172 is applied and initially cured at
100°C for 30 minutes, followed by a 15 minute cure at 125°C as
per the vendor's recommendations. Prior to applying this under-
fill, a damming material, Emerson and Cumming, 50300HT
should be applied around the perimeter of the BGA device in
order to contain the underfill. The 50300HT is cured for 1 hour at
125°C (there are other underfill materials available that may or
may not require the use of damming material).
FIGURE 16. THERMAL DESIGN FOR BGA PACKAGES
相关PDF资料 |
PDF描述 |
|---|---|
| BU-61840B3-300Y | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128 |
| BU-61860B3-102 | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128 |
| BU-61860B3-402W | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128 |
| BU-61860B4-100Z | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128 |
| BU-61860B4-200S | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BU-61840B3NEW | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MIL-STD-1553 Components |μ-ACE (Micro-ACE?) |
| BU-61843 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:MIL-STD-1553 Components |Enhanced Mini-ACE? |
| BU-61843F3-100 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Telecommunication IC |
| BU-61843F3-110 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Telecommunication IC |
| BU-61843F4-100 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Telecommunication IC |
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