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| 型号： | BX80547RE2533C |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 72/94页 |
| 文件大小： | 2796K |
| 代理商： | BX80547RE2533C |
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74
Datasheet
Thermal Specifications and Design Considerations
5.1.2
Thermal Metrology
specifications are meant to help ensure proper operation of the processor. Figure 5-2 illustrates
where Intel recommends TC thermal measurements should be made. For detailed guidelines on
temperature measurement methodology, refer to the Intel Pentium 4 Processor on 90 nm
Process in the 775-Land LGA Package Thermal Design Guide.
5.2
Processor Thermal Features
5.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the TCC when
the processor silicon reaches its maximum operating temperature. The TCC reduces processor
power consumption as needed by modulating (starting and stopping) the internal processor core
clocks. The Thermal Monitor feature must be enabled for the processor to be operating
within specifications. The temperature at which Thermal Monitor activates the thermal control
circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal
manner, and interrupt requests are latched (and serviced during the time that the clocks are on)
while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle
specific to the processor (typically 30–50%). Clocks often will not be off for more than 3.0 s
when the TCC is active. Cycle times are processor speed dependent and will decrease as processor
core frequencies increase. A small amount of hysteresis has been included to prevent rapid active/
inactive transitions of the TCC when the processor temperature is near its maximum operating
temperature. Once the temperature has dropped below the maximum operating temperature, and
the hysteresis timer has expired, the TCC goes inactive and clock modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
Figure 5-2. Case Temperature (TC) Measurement Location
Measure from edge of top surface of processor IHS
14.35 mm
37.5 mm x 37.5 mm Substrate
Measure TC at this point
(geometric center of the
top surface of the IHS)
14.35 mm
Measure from edge of top surface of processor IHS
14.35 mm
37.5 mm x 37.5 mm Substrate
Measure TC at this point
(geometric center of the
top surface of the IHS)
14.35 mm
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相关代理商/技术参数 |
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|---|---|
| BX80547RE2533CNS L7TU | 制造商:Intel 功能描述: |
| BX80547RE2667C S L7TM | 制造商:Intel 功能描述:MPU CELERON D 90NM 2.66GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80547RE2667CNS L98V | 制造商:Intel 功能描述: |
| BX80547RE2800C S L7TN | 制造商:Intel 功能描述:MPU CELERON D 90NM 2.8GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80547RE2800CNS L98W | 制造商:Intel 功能描述:MPU Celeron? D Processor 336 90nm 2.8GHz 775-Pin FCLGA4 |
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