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参数资料
| 型号： | BX80547RE2533C |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 85/94页 |
| 文件大小： | 2796K |
| 代理商： | BX80547RE2533C |
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Datasheet
Boxed Processor Specifications
7.1.2
Boxed Processor Fan Heatsink Weight
The boxed processor fan heatsink will not weigh more than 450 grams. Refer to Chapter 5 and the
Intel Pentium 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design
Guide for details on the processor weight and heatsink requirements.
7.1.3
Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly
The boxed processor thermal solution requires a heatsink attach clip assembly to secure the
processor and fan heatsink in the baseboard socket. The boxed processor will ship with the heatsink
attach clip assembly.
7.2
Electrical Requirements
7.2.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable will be
shipped with the boxed processor to draw power from a power header on the baseboard. The power
cable connector and pinout are shown in Figure 7-5. Baseboards must provide a matched power
header to support the boxed processor. Table 7-1 contains specifications for the input and output
signals at the fan heatsink connector.
The fan heatsink outputs a SENSE signal that is an open- collector output that pulses at a rate of
2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match the system board-
mounted fan speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the
SENSE signal is not used, pin 3 of the connector should be tied to GND.
The fan heatsink receives a PWM signal from the motherboard from the 4th pin of the connector
labeled as CONTROL.
Note:
The boxed processor’s fan heatsink requires a constant +12 V supplied to pin 2 and does not
support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the platform user’s
manual, or on the system board itself. Figure 7-6 shows the location of the fan power connector
relative to the processor socket. The baseboard power header should be positioned within
4.33 inches from the center of the processor socket.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BX80547RE2533CNS L7TU | 制造商:Intel 功能描述: |
| BX80547RE2667C S L7TM | 制造商:Intel 功能描述:MPU CELERON D 90NM 2.66GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80547RE2667CNS L98V | 制造商:Intel 功能描述: |
| BX80547RE2800C S L7TN | 制造商:Intel 功能描述:MPU CELERON D 90NM 2.8GHZ 775PIN FCLGA4 - Boxed Product (Development Kits) |
| BX80547RE2800CNS L98W | 制造商:Intel 功能描述:MPU Celeron? D Processor 336 90nm 2.8GHz 775-Pin FCLGA4 |
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