参数资料
型号: BX80547RE2933CN
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775
封装: FLIP CHIP, LGA-775
文件页数: 82/94页
文件大小: 2796K
代理商: BX80547RE2933CN
Datasheet
83
Boxed Processor Specifications
7
Boxed Processor Specifications
The Celeron D processor in the 775-land package will also be offered as an boxed Intel processor.
Boxed Intel processors are intended for system integrators who build systems from baseboards and
standard components. The boxed Celeron D processor in the 775-land package will be supplied
with a cooling solution. This chapter documents baseboard and system requirements for the
cooling solution that will be supplied with the boxed Celeron D processor in the 775-land package.
This chapter is particularly important for OEMs that manufacture baseboards for system
integrators. Figure 7-1 shows a mechanical representation of a boxed Celeron D processor in the
775-land package.
Note:
Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and
inches [in brackets].
Note:
Drawings in this section reflect only the specifications on the boxed Intel processor product. These
dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system
designer’s responsibility to consider their proprietary cooling solution when designing to the
required keep-out zone on their system platforms and chassis. Refer to the Intel Pentium 4
Processor on 90 nm Process in the 775-Land LGA Package Thermal Design Guide for further
guidance.
NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink.
Figure 7-1. Mechanical Representation of the Boxed Processor
相关PDF资料
PDF描述
BX80551PG2800FN 32-BIT, 2800 MHz, MICROPROCESSOR, PBGA775
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BX80552360 32-BIT, 3460 MHz, MICROPROCESSOR, CBGA775
BX80552651 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775
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相关代理商/技术参数
参数描述
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