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| 型号： | BX80547RE2933CN |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 91/94页 |
| 文件大小： | 2796K |
| 代理商： | BX80547RE2933CN |
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Datasheet
91
Boxed Processor Specifications
If the boxed processor fan heatsink 4-pin connector is connected to a 4-pin motherboard header and
the motherboard is designed with a fan speed controller with PWM output (see CONTROL in
Table 7-1) and remote thermal diode measurement capability, the boxed processor will operate as
follows:
As processor power has increased the required thermal solutions have generated increasingly more
noise. Intel has added an option to the boxed processor that allows system integrators to have a
quieter system in the most common usage.
The 4th wire PWM solution provides better control over chassis acoustics. This is achieved by
more accurate measurement of processor die temperature through the processor’s temperature
diode (TDIODE). Fan RPM is modulated through the use of an ASIC located on the motherboard
that sends out a PWM control signal to the 4th pin of the connector labeled as CONTROL. The fan
speed is based on actual processor temperature instead of internal ambient chassis temperatures.
If the new 4-pin active fan heat sink solution is connected to an older 3-pin baseboard, processor
fan header, it will default back to a thermistor controlled mode, allowing compatibility with
existing 3-pin baseboard designs. Under thermistor controlled mode, the fan RPM is automatically
varied based on the inlet temperature measured by a thermistor located at the fan inlet.
Note:
For more details on specific motherboard requirements for 4-wire based fan speed control, see the
Intel Pentium 4 Processor on 90 nm Process in the 775-Land LGA Package Thermal Design
Guide.
§
Table 7-2. Boxed Processor Fan Heatsink Set Points
Boxed Processor
Fan Heatsink Set
Point (C)
Boxed Processor Fan Speed
Notes
X
≤ 30
When the internal chassis temperature is below or equal to this set
point, the fan operates at its lowest speed. Recommended maximum
internal chassis temperature for nominal operating environment.
1
NOTES:
1.
Set point variance is approximately ±1°C from fan heatsink to fan heatsink.
Y = 34
When the internal chassis temperature is at this point, the fan operates
between its lowest and highest speeds. Recommended maximum
internal chassis temperature for worst-case operating environment.
Z
≥ 38
When the internal chassis temperature is above or equal to this set
point, the fan operates at its highest speed.
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相关代理商/技术参数 |
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|---|---|
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