参数资料
型号: CDP68HC68T1MZ96
厂商: Intersil
文件页数: 12/23页
文件大小: 0K
描述: IC RTC RAM/SPI SERIAL 20-SOIC
标准包装: 1,000
类型: 时钟/日历
特点: 警报器,闰年,方波输出,监视计时器
存储容量: 32B
时间格式: HH:MM:SS(12/24 小时)
数据格式: YY-MM-DD-dd
接口: SPI
电源电压: 3 V ~ 6 V
电压 - 电源,电池: 2.2 V ~ 6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC W
包装: 带卷 (TR)
2
FN1547.8
October 29, 2007
Ordering Information
PART NUMBER
PART MARKING
TEMP RANGE (°C)
PACKAGE
PKG DWG. #
CDP68HC68T1E
-40 to +85
16 Ld PDIP
E16.3
CDP68HC68T1EZ (Note)
CDP68HC68T1EZ
-40 to +85
16 Ld PDIP**
(Pb-free)
E16.3
CDP68HC68T1M*
68HC68T1M
-40 to +85
20 Ld SOIC
Tape and Reel
M20.3
CDP68HC68T1MZ* (Note)
68HC68T1MZ
-40 to +85
20 Ld SOIC (Pb-free)
Tape and Reel
M20.3
CDP68HC68T1M2*
HC68T1M2
-40 to +85
16 Ld SOIC
Tape and Reel
M16.3
CDP68HC68T1M2Z* (Note)
HC68T1M2Z
-40 to +85
16 Ld SOIC (Pb-free)
Tape and Reel
M16.3
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
CDP68HC68T1
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