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参数资料
| 型号： | DC1472A |
| 厂商： | Linear Technology |
| 文件页数： | 13/24页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO LTM4618 |
| 软件下载： | LTM4618 Spice Model |
| 设计资源： | DC1472A Design Files DC1472A Schematic |
| 标准包装： | 1 |
| 系列： | µModule® |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 1.2V，1.5V，1.8V，2.5V，3.3V，5V |
| 电流 - 输出： | 6A |
| 输入电压： | 4.5 ~ 26.5 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 500kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | LTM4618 |
| 相关产品： | LTM4618IV#PBF-ND - IC DC-DC UMODULE BUCK 6A 84-LGA LTM4618EV#PBF-ND - IC DC-DC UMODULE BUCK 6A 84-LGA |
| 其它名称： | DC1472 DC1472-ND |
LTM4618
APPLICATIONS INFORMATION
Slope Compensation
The module has already been internally compensated for
all output voltages. LTpowerCAD is available for further
control loop optimization.
RUN Pin
The RUN pin has a 1μA pull-up current source that will
enable the device in a ?oat condition. A voltage divider
can be used to enable a UVLO function using the RUN
pin. See Figure 21.
Fault Conditions: Current Limit and Overcurrent
Foldback
The LTM4618 has a current mode controller, which inher-
ently limits the cycle-by-cycle inductor current not only in
steady-state operation, but also in transient.
To further limit current in the event of an overload condi-
tion, the LTM4618 provides foldback current limiting. If the
output voltage falls by more than 40%, then the maximum
output current is progressively lowered to about 25% of
its full current limit value.
Thermal Considerations and Output Current Derating
The thermal resistances reported in the Pin Con?guration
section of the data sheet are consistent with those param-
eters de?ned by JESD51-9 and are intended for use with
?nite element analysis (FEA) software modeling tools that
leverage the outcome of thermal modeling, simulation,
and correlation to hardware evaluation performed on a
μModule regulator package mounted to a hardware test
board—also de?ned by JESD51-9 (“Test Boards for Area
Array Surface Mount Package Thermal Measurements”).
The motivation for providing these thermal coef?cients in
found in JESD 51-12 (“Guidelines for Reporting and Using
Electronic Package Thermal Information”).
Many designers may opt to use laboratory equipment
and a test vehicle such as the demo board to anticipate
the μModule regulator’s thermal performance in their ap-
plication at various electrical and environmental operating
conditions to compliment any FEA activities. Without FEA
software, the thermal resistances reported in the Pin Con-
?guration section are in-and-of themselves not relevant to
providing guidance of thermal performance; instead, the
derating curves provided in the data sheet can be used in
a manner that yields insight and guidance pertaining to
one’s application-usage, and can be adapted to correlate
thermal performance to one’s own application.
The Pin Con?guration section shows four thermal coef-
?cients explicitly de?ned in JESD 51-12; these coef?cients
are quoted or paraphrased below:
? θ JA , the thermal resistance from junction to ambi-
ent, is the natural convection junction-to-ambient
air thermal resistance measured in a one cubic foot
sealed enclosure. This environment is sometimes
referred to as “still air” although natural convection
causes the air to move. This value is determined with
the part mounted to a JESD 51-9 de?ned test board,
which does not re?ect an actual application or viable
operating condition.
? θ JCbottom , the thermal resistance from junction to the
bottom of the product case, is the junction-to-board
thermal resistance with all of the component power
dissipation ?owing through the bottom of the pack-
age. In the typical μModule regulator, the bulk of the
heat ?ows out the bottom of the package, but there
is always heat ?ow out into the ambient environment.
As a result, this thermal resistance value may be use-
ful for comparing packages but the test conditions
don’t generally match the user’s application.
? θ JCtop , the thermal resistance from junction to top
of the product case, is determined with nearly all of
the component power dissipation ?owing through
the top of the package. As the electrical connections
of the typical μModule regulator are on the bottom
of the package, it is rare for an application to operate
such that most of the heat ?ows from the junction to
the top of the part. As in the case of θ JCbottom , this
value may be useful for comparing packages but the
test conditions don’t generally match the user’s ap-
plication.
? θ JB , the thermal resistance from junction to the
printed circuit board, is the junction-to-board thermal
resistance where almost all of the heat ?ows through
the bottom of the μModule regulator and into the
4618fa
13
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