参数资料
型号: DMN32D2LV-7
厂商: Diodes Inc
文件页数: 2/6页
文件大小: 0K
描述: MOSFET N-CH DUAL 30V SOT-563
产品变化通告: Bond Wire Change 11/Nov/2011
标准包装: 1
FET 型: 2 个 N 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 400mA
开态Rds(最大)@ Id, Vgs @ 25° C: 1.2 欧姆 @ 100mA,4V
Id 时的 Vgs(th)(最大): 1.2V @ 250µA
输入电容 (Ciss) @ Vds: 39pF @ 3V
功率 - 最大: 400mW
安装类型: 表面贴装
封装/外壳: SOT-563,SOT-666
供应商设备封装: SOT-563
包装: 标准包装
其它名称: DMN32D2LV-7DIDKR
DMN32D2LV
Maximum Ratings
(@T A = +25°C, unless otherwise specified.)
Drain Source Voltage
Gate-Source Voltage
Drain Current (Note 5)
Characteristic
Symbol
V DSS
V GSS
I D
Value
30
? 10
400
Unit
V
V
mA
Thermal Characteristics
(@T A = +25°C, unless otherwise specified.)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
P D
R θ JA
T J , T STG
400
313
-55 to +150
mW
? C/W
? C
Electrical Characteristics
(@T A = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV DSS
30
?
?
V
V GS = 0V, I D = 250 μ A
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Body Leakage (Note 7)
@ T J = +25°C
@ T J = +25°C
@ T J = +105°C
@ T J = +125°C
I DSS
I GSS
I GSS
?
?
?
?
??
??
? 1
? 8
? 15
1
? 10
? 500
? 100
? 100
? 100
? A
? A
nA
nA
nA
nA
V DS = 30V, V GS = 0V
V GS = ±10V, V DS = 0V
V GS = ±5V, V DS = 0V
V GS = ±2.5V, V DS = 0V
V GS = ±2.5V, V DS = 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
Source-Drain Diode Forward Voltage
V GS(th)
R DS (ON)
|Y fs |
V SD
0.6
??
??
?
100
0.5
?
??
??
?
?
?
1.2
2.2
1.5
1.2
?
1.4
V
?
mS
V
V DS = V GS , I D = 250 μ A
V GS = 1.8V, I D = 20mA
V GS = 2.5V, I D = 20mA
V GS = 4.0V, I D = 100mA
V DS =10V, I D = 0.1A
V GS = 0V, I S = 115mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C iss
C oss
C rss
?
?
?
39
10
3.6
?
?
?
pF
pF
pF
V DS = 3V, V GS = 0V
f = 1.0MHz
Switching Time
Turn-on Time
Turn-off Time
t on
t off
??
??
11
51
??
??
nS
nS
V DD = 5V, I D = 10 mA,
V GS = 5V
Notes:
5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to production testing.
DMN32D2LV
Document number: DS31121 Rev. 7 - 2
2 of 6
www.diodes.com
January 2014
? Diodes Incorporated
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