参数资料
型号: DP5Z2MW16PH3-15C
元件分类: PROM
英文描述: 2M X 16 FLASH 5V PROM MODULE, 120 ns, QFP48
封装: HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
文件页数: 1/21页
文件大小: 4549K
代理商: DP5Z2MW16PH3-15C
32 Megabit FLASH EEPROM
DP5Z2MW16Pn3
PRELIMINARY
DESCRIPTION:
The DP5Z2MW16Pn3 ‘’SLCC’’ devices are a revolutionary new memory
subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip
Carriers (SLCC). Available unleaded, straight leaded, ‘’J’’ leaded, gullwing
leaded packages, or mounted on a 50-pin PGA co-fired ceramic substrate.
The Device packs 64-Megabits of FLASH EEPROM in an area as small as 0.463
in2, while maintaining a total height as low as 0.171 inches.
The DP5Z2MW16Pn3 contains two individual 1 Meg x 16 FLASH EEPROM
memory devices. Each SLCC is hermetically sealed making the module
suitable for commercial, industrial and military applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher board density
of memory than available with conventional through-hole, surface mount or
hybrid techniques.
FEATURES:
Organization: 2Meg x 16
Fast Access Times: 120, 150, 200ns (max.)
Single 5.0 Volt
High-Density Symmetrically Blocked Architecture
- Sixteen 64 K Word Blocks Per Device
Extended Cycling Capability
- 100K Write/Erase Cycles
Automated Erase and Program Cycles
- Command User Interface
- Status Register
SRAM-Compatible Write Interface
Hardware Data Protection Feature
- Erase / Write Lockout during Power Transitions
Packages Available:
DP5Z2MW16PY3
48 - Pin SLCC
DP5Z2MW16PI3
48 - Pin Straight Leaded SLCC
DP5Z2MW16PH3 48 - Pin Gullwing Leaded SLCC
DP5Z2MW16PJ3
48 - Pin ‘’J’’ Leaded SLCC
DP5Z2MW16PA3
50 - Pin PGA Dense-SLCC
2Mx16, 120 - 200ns, STACK/PGA
30A161-22
A
This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
SLCC Stack
Straight Leaded
Stack
‘’J’’ Leaded
Stack
Gullwing
Leaded Stack
Dense-Stack
30A161-22
REV. B
1
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